Other

Sharp Kabushiki Kaisha Corporation

Mitsubishi Chemical Corporation

Noriyuki Saitou

Makoto Ishikawa

Kazunori Inoue

Takuji Yoshida

Keiichi Sawai

Masaki Munakata

Satoshi Kumon

Hirohito Komatsu

Toshiaki Sakakihara

Yoshihide Suzuki

Masakazu Motoi

Nobuhiro Goda

Kazuma Teramoto

Masaru Miyoshi

Yoshio Kamiharaguchi

An etching liquid contains iodine, an iodine compound and alcohol as solute, and solvent such as water. The etching liquid etches a gold or gold alloy layer formed on the surface of a substrate for a semiconductor device or a liquid crystal device evenly. A plurality of gold or gold alloy columns is formed on the layer. The columns are etched scarcely by the etching liquid. The etching liquid etches the gold or gold alloy layer existing between the columns evenly. The etching liquid may further contain a surfactant.

Etching liquid

A silver or silver alloy thin layer on a substrate is etched by an etching liquid uniformly without producing an etching residue while avoiding side etching due to over etching. The etching liquid contains silver ions in a range from 0.005 to 1 weight %. The etching liquid is fed to a tank or an etching liquid feeding apparatus, and then brought into contact with the silver or silver alloy thin layer on the substrate.

Etching method and etching liquid

An etchant for patterning thin metal films by wet etching and in particular, an etchant for use in producing semiconductor devices, such as semiconductor elements and liquid-crystal display elements, is for application to a multilayer film having a first layer made of aluminum or an aluminum alloy having formed thereon a second layer made of aluminum or an aluminum alloy each containing at least one element selected from nitrogen, oxygen, silicon, and carbon, and has a phosphoric acid content of from 35 to 65% by weight and a nitric acid content of from 0.5 to 15% by weight; and an etching is performed using the etchant.

Etchant and method of etching

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Fukuoka, Japan

Noriyuki Saitou