Yamaichi Electronics Co., Ltd.

Yamaichi Electric Mfg. Co., Ltd.

Yamaichi Electric Co., Ltd.

Yamaichi Electric Manufacturing Co., Ltd.

Yamachi Electric Co., Ltd.

Noriyuki Matsuoka

Kazumi Uratsuji

Takeyuki Suzuki

Minoru Hisaishi

Masaaki Kubo

Masanori Egawa

Junji Ishida

Yoshiyuki Kato

Shunji Abe

Toru Takahashi

Yoshinori Wakabayashi

Tomio Sasaki

Hideki Sagano

Ryuichi Nakamura

Takahiro Ishibashi

Katunori Takahashi

Eisaku Tsubota

Toshitaka Kuroda

Motoki Kosugi

Michael K Pierson

In a contact block comprising a contact holder having multiple through-holes arranged in a position adjustment direction, two positioning pins are inserted via the through-holes to two through-holes selected from multiple through-holes formed in a contact block accommodation portion in the position adjustment direction, and thereby the relative positions of contact portions of contact terminals held by the contact holder can be adjusted with respect to terminals of a semiconductor device.

Semiconductior device socket including contact block

In a carrier unit, a posture-stabilizing memberfor stabilizing a bare chip to be generally parallel to a flat surface of an electrode sheetis placed on the electrode sheetin a carrier unit

Carrier unit for a semiconductor device and semiconductor socket using the same

Base for a semiconductor carrier

Cover for a semiconductor carrier

Semiconductor carrier

The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

Socket for semiconductor device

A method for forming a recognition mark on the back surface of a substrate for a KGD that can be easily produced at a low manufacturing cost and permits repeated use of a substrate is provided. In the method, wiring patterns are formed on a surface of one side of an insulating substrate. The method includes a step of forming a conductive pattern as a recognition mark on one surface where the wiring patterns are formed, and a step of forming a through hole from a surface where the wiring pattern is not formed toward the conductive pattern. In the substrate, bumps connected with the KGD are formed on the surface on which the wiring patterns are not formed. Also, the conductive pattern may have a shape as the recognition mark or the through hole may have the shape as the recognition mark.

Method for forming a recognition mark on a substrate for a KGD

A latch locking mechanism of a KGD carrier includes a carrier retaining member having a cover and a chip retaining member, a carrier base assembly having a carrier main body, a substrate, and a carrier base, at least two opposite latches rotationally movably provided on the cover of the carrier retaining member and each including an operation portion and a locking portion which generally form an L shape, and engaging portions provided on the carrier main body of the carrier base assembly to engage with the corresponding locking portions of the latches. When the locking portions of the two opposite latches are closed, the locking portions engage with the corresponding engaging portions provided on the carrier main body to lock the carrier retaining member and the carrier base assembly.

Latch locking mechanism of a KGD carrier

A KGD carrier holds the IC chip by means of a carrier retaining member and a carrier base assembly. The carrier base assembly includes a carrier body, a carrier base and a substrate. The carrier body is provided with grooves, which are located opposing to pads formed on a peripheral portion of the substrate, to permit the in-and-out motion of contacts of the IC socket. The carrier base is provided with the grooves, which are located opposing to the pads formed on the peripheral portion of the substrate, to permit the in-and-out motion of the contacts of the IC socket. The substrate is interposed between the carrier body and the carrier base so as to enable the pads of the substrate and the corresponding contacts of the IC socket to be electrically connected with each other.

KGD carrier and an IC mounting socket mounting it

An open top IC socket according to the present invention includes a plurality of IC package mounting units each including a socket body that includes a plurality of pairs of contact sections into which terminals of an IC package are inserted and each of which is able to open and close, and each further including a slide block slidably overlapped on the socket body for opening and closing the contact sections, a socket base for containing and holding the IC package mounting units in an aligned state, a coupling member for mutually coupling the individual slide blocks of the IC package mounting units, and a block operation element mounted on the socket base for sliding the individual slide blocks in the direction of sliding of the slide blocks. According to the present invention, the mounting and detaching of the plurality of the IC packages can be achieved simultaneously.

Open top IC socket

An IC carrier includes a carrier base, a carrier cover and a wiring sheet, through which an IC and a socket contact each other, interposed between the carrier cover and the wiring sheet. The IC is retained by the carrier base such that the IC and the wiring sheet face each other. The IC carrier further includes a plurality of connecting pins projecting from an opposing surface of one of the carrier base and the carrier cover. The connecting pins are inserted into through-holes formed in the wiring sheet and then press fitted into connecting holes formed in the other of the carrier base and the cover, so that an area in the vicinity of a peripheral edge of the wiring sheet is sandwiched between the carrier base and the carrier cover.

IC carrier

An IC carrier retains an IC and a wiring sheet in an opposed relation so that electrical connection can be achieved between the IC and a socket through the wiring sheet. The IC carrier comprises a slip-preventive sheet capable of suppressing lateral displacement of the wiring sheet with respect to the IC by exerting a surface pressure against the wiring sheet.

Between an IC and an IC receptacle is interposed a flexible wiring sheet, via which contact pieces of the IC and contacts of the IC receptacle are held in contact with one another. In this case, lateral deviation and flexing of the wiring sheet are prevented satisfactorily, and proper contact between the IC and IC receptacle is ensured. A back-up frame is applied by adhesive to the flexible wiring sheet to form a contact agency. The back-up frame 11 has a central window 11 to form a non-backed-up region in a central portion of the flexible wiring sheet 3 that covers the window. The IC 3 and flexible wiring sheet are held in forced contact with each other in the non-backed-up region. The back-up frame has an outer edge portion forming a back-up region for backing up an edge portion of the wiring sheet. In this back-up region, the IC receptacle and the flexible wiring sheet 1 are held in contact with each other.

Contact agency interposed between IC and IC receptacle

An IC carrier includes a carrier body for retaining a flexible wiring sheet and an IC in an opposing relation. The carrier body has suction holes formed in a flexible wiring sheet placing surface thereof and extending all the way through the carrier body. A negative pressure is applied to the flexible wiring sheet through the suction holes, thereby retaining a relative position between the flexible wiring sheet and the carrier body.

An IC career includes a movable corner ruler for regulating one of the two diagonally opposed corner portions which are situated on opposite corners of an IC, and a reference ruler for regulating the other corner portion. The movable ruler is resiliently retained by a first and a second plate spring extending along the two sides forming the first-mentioned corner portion of the IC such that the first-mentioned one corner portion is resiliently urged towards the reference corner ruler. The first and second plate springs are connected with each other through a connection piece integrally blanked together with the first and second plate springs, and internal ends of the first and second plate springs extend from connection portions with respect to the connection piece so as to define free ends.

Growing community of inventors

Yokohama, Japan

Noriyuki Matsuoka