Screen Holdings Co., Ltd.

Noriyuki Kikumoto

Shuichi Yasuda

Michinori Iwao

Kazuhiro Fujita

Hiroyuki Kawahara

Yuzo Uchida

Hiroshi Abe

Manabu Okutani

Koji Hashimoto

Naohiko Yoshihara

Kazuki Inoue

Kazuhiro Honsho

Yuichi Takayama

Kunio Yamada

Tetsuo Ito

Masahiro Kimura

Takahiro Yamaguchi

Toyohide Hayashi

Takuya Sato

Hiromichi Kaba

Noritake Sumi

Toshihito Morioka

Wataru Sakai

Kazuhiko Nakazawa

Hiroshi Ebisui

Mitsutoshi Sasaki

Mizuki Osawa

Naoto Fujita

Disclosed are a substrate treating apparatus and a substrate transporting method. The substrate treating apparatus includes a first transport mechanism. The first transport mechanism includes a hand. A hand includes a base, a suction portion, a first receiver, a second receiver, and a receiver driving unit. The suction portion is attached to the base. The suction portion flows gas along a top face of a substrate, and sucks the substrate upward without contacting the substrate. The first receiver and the second receiver are supported on the base. The first receiver and the second receiver are disposed below the substrate sucked by the suction portion. The first receiver and the second receiver can receive a back face of the substrate. The receiver driving unit moves the second receiver with respect to the base. The receiver driving unit causes the second receiver to access the first receiver and to move away from the first receiver.

Substrate treating apparatus and substrate transporting method

A substrate processing apparatus includes a suctioning unit for suctioning a processing liquid existing inside a processing liquid pipe that communicates with a discharge port, and a controller. In the suctioning step, the controller executes a suctioning step of suctioning the processing liquid existing inside the processing liquid pipe by the suctioning unit. The controller selectively executes a first suctioning step of retracting a leading end surface of the processing liquid and disposing the leading end surface of the processing liquid after suctioning in a preliminarily set standby position inside the processing liquid pipe, and a second suctioning step of retracting the leading end surface of the processing liquid further back than the standby position. After the second suctioning step, the controller further executes a standby position disposing step of supplying the processing liquid to the processing liquid pipe by the processing liquid supplying unit and disposing the leading end surface of the processing liquid in the standby position.

Substrate processing device and substrate processing method

Disclosed is a substrate treating apparatus for performing a cleaning treatment on substrates. The apparatus includes an indexer block with an indexer robot, a treating block including a cleaning unit, and a path block disposed between the indexer block and the treating block. The indexer robot includes a guide rail, a base, an articulated arm, and a hand. The guide rail is positioned so as not to overlap a mount position of a substrate in the path block.

Substrate treating apparatus

Disclosed is a substrate treating apparatus for performing a cleaning treatment on substrates. The apparatus includes an indexer block with an indexer robot, a treating block including a front face cleaning unit and a back face cleaning unit as treating units, and a reversing path block including a plurality of shelves on which substrates are placed, and having a reversing function. The indexer robot includes a guide rail, a base, an articulated arm, and a hand. The guide rail is positioned so as not to overlap a mount position of a substrate in the reversing path block.

Disclosed is a substrate treating apparatus that performs a cleaning treatment on substrates. A treating block includes a plurality of treating units in an upper and lower stages, respectively. The treating block includes a front face cleaning unit and a back face cleaning unit, each being at least one in number, in the upper stage. The treating block includes at least one tower unit including the front face cleaning unit and the back face cleaning unit, each being at least one in number, in the lower stage. Moreover, a transportation block is provided that includes a center robot in each of the upper and lower stages.

A substrate processing apparatus includes a base portionthat is disposed in a manner of being adjacent to a chamber; a handthat holds a substrate S; an armthat is attached to the base portion, supports the hand, and moves the hand forward and rearward by horizontally moving the hand with respect to the base portion; and a cover portionthat accommodates the hand in an internal space. The cover portion has a cover main bodyforming the internal space and an extending memberhaving a hollow structure which penetrates the cover portion in a horizontal direction and of which one end serves as an openingand being engaged with the cover main body in a state of being movable in the horizontal direction while the opening communicates with the internal space.

Substrate processing apparatus

In a substrate processing apparatus, a transport robot which transports a substrate between an indexer part and a substrate processing part is installed in a substrate transport part. The transport fan filter unit is provided in an upper part of the substrate transport part. An exhaust port is provided in the substrate transport part. The circulation piping allows the exhaust port of the substrate transport part and the transport fan filter unit to communicate with each other. The exhaust pipe is connected to the circulation piping. The inert gas supply part supplies an inert gas to the circulation piping. The circulation fan filter unit is disposed downstream of a connecting portion of the circulation piping with the exhaust pipe to be parallel to a flow path of the circulation piping.

A substrate processing device is provided. A chamber has a side wall part and a top wall part and contains a substrate holding part. A first gas supply part is disposed in the top wall part and supplies a first gas toward a side on which the substrate holding part is positioned. A second gas supply part is contained in the chamber and supplies a second gas to an inside of the chamber. A control unit controls the first and second gas supply part. The second gas is a gas different from oxygen and an allotrope of oxygen. The second gas supply part has an air feeding port part which is positioned on an upward side of a holding position of a substrate by the substrate holding part in a vertical direction and is positioned on an outward side of the substrate holding part in a horizontal direction.

A first processing module includes a first specified processing unit and a first delivery part. A substrate supply part is on a first direction side of the first processing module. A transfer module is on a second direction side on the opposite of the first processing module from the first direction. The transfer module includes a frame, a first floor, a second floor, and a gateway. The frame defines a placement space in which a first transfer apparatus of the transfer module is placed. A first transfer apparatus is installed on the first floor. The second floor is on a third direction side, which is a horizontal direction orthogonal to the first direction, with respect to the first floor inside the placement space. The gateway is provided on the third direction side with respect to the second floor and communicates the placement space to the outside of the frame.

Substrate processing apparatus, transfer module, and coupling module

A substrate treatment apparatus is provided with a plurality of substrate treatment parts and a liquid treatment system. The substrate treatment part has a substrate retaining part, which retains a substrate, and a discharge nozzle, which discharges a treatment liquid to the substrate retained by the substrate retaining part. The liquid treatment system has: a storage tank that stores in the treatment liquid; a supply piping part that is connected to the storage tank and forms a supply passage through which the treatment liquid to be supplied to the discharge nozzle passes; a return piping part that is connected to the storage tank and forms a return passage that returns the treatment liquid passed through the supply piping part to the storage tank; and a gas supply part that supplies a nitrogen gas different from oxygen dissolved in the treatment liquid into the return passage of the return piping part.

Substrate treatment apparatus and substrate treatment method

A substrate drying method includes a sublimation-agent-liquid-film placing step of placing a liquid film of a liquid sublimation agent on the front surface of the substrate, a high vapor-pressure liquid supply step of supplying a high vapor-pressure liquid that has vapor pressure higher than the sublimation agent and that does not include water to a rear surface that is a surface on a side opposite to the front surface in the substrate, a vaporizing/cooling step of, after the liquid film of the sublimation agent is placed on the front surface of the substrate, stopping supplying the high vapor-pressure liquid, and, as a result, losing vaporization heat in response to vaporization of the high vapor-pressure liquid, and, as a result, cooling the sublimation agent, and, as a result, solidifying the liquid film of the sublimation agent and a sublimating step of sublimating a sublimation-agent film.

Substrate drying method and substrate processing apparatus

A substrate processing apparatus includes a processing liquid supply nozzle to supply a processing liquid to a substrate, a storage portion that stores the processing liquid supplied, a liquid-sending pipe that sends the processing liquid stored in the storage portion to the nozzle, a flow pipe that allows a processing liquid to flow therethrough, an oxygen concentration meter interposed in the flow pipe, a hypoxic fluid supply pipe that is in communication with the flow pipe and that sends a hypoxic fluid to the flow pipe, and a flow rate changing valve interposed in the hypoxic fluid supply pipe. A flow-rate-changing controller controls the flow rate changing valve so that the hypoxic fluid is supplied to the flow pipe until an inside of the flow pipe is filled with the hypoxic fluid when the processing liquid inside the flow pipe is drained.

Substrate processing apparatus, processing liquid draining method, processing liquid replacing method, and substrate processing method

A substrate drying method for drying a front surface of a substrate having a pattern includes a sublimation-agent-liquid-film placing step of placing a liquid film of a liquid sublimation-agent on the front surface of the substrate, a high vapor-pressure liquid placing step of placing a liquid film of a high vapor-pressure liquid that has vapor pressure higher than the sublimation agent and that does not include water on the liquid film of the sublimation-agent placed on the front surface of the substrate, a vaporizing/cooling step of losing vaporization heat in response to vaporization of the high vapor-pressure liquid, and, cooling the sublimation-agent, and, as a result, solidifying the liquid film of the sublimation-agent, and, forming a sublimation-agent film on the front surface of the substrate, and a sublimating step of sublimating the sublimation-agent film.

A substrate processing apparatus includes a substrate holder that holds a substrate, a processing liquid piping that is communicatively connected with a discharge port for discharging a processing liquid, a processing liquid supplier that supplies the processing liquid to the processing liquid piping, a suction unit for suctioning the processing liquid present inside the processing liquid piping, and a controller which controls the processing liquid supplying unit and the suction unit. The controller executes a processing liquid supplying step that supplies the processing liquid to the processing liquid piping and a suctioning step that suctions the processing liquid inside the processing liquid piping by the suction unit. The controller selectively executes a first suctioning step and a second suctioning step of the processing liquid.

A substrate processing apparatus includes a spin chuck, rotating a disk-shaped substrate around a rotational axis while holding it horizontally, a cylindrical guard, receiving a processing liquid scattered outward from the substrate held by the spin chuck, and a centering unit, which brings a center of the substrate close to the rotational axis. The centering unit includes a pusher, contacting the substrate on the spin chuck, and a linear motor, moving the pusher horizontally to move the substrate horizontally with respect to the spin chuck. At least a portion of the linear motor is disposed above the guard such as to overlap with the guard in plan view.

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Kyoto, Japan

Noriyuki Kikumoto