Adv Antest Corporation

Takeda Riken Co., Ltd.

Noriyuki Igarashi

Keiichi Fukumoto

Kenichi Shimada

Hiroto Nakamura

Hiroyuki Takahashi

Yutaka Watanabe

Toshiyuki Kiyokawa

Tsuyoshi Yamashita

Noboru Saito

Haruki Nakajima

Hiroshi Sato

Katsumi Kojima

Kohei Sato

Yoshihito Kobayashi

Akio Kojima

Noboru Masuda

Hisao Hayama

Kenpei Suzuki

Tadashi Kainuma

Toshio Kashiwazaki

Yuichi Nansai

Yushi Iwanaga

Kempei Suzuki

Shinichi Koya

A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.

Cooling fin connected to a cooling unit and a pusher of the testing apparatus

A handleris provided with an inner chambercontaining inside thereof heat sinksof pushers, a temperature adjusting unitfor controlling the atmosphere temperature inside the inner chamber, a test chambercontaining inside thereof socketslocated on the test headand the inner chamber, and a temperature adjusting unitfor controlling the atmosphere temperature inside the test chamber. With such a handler, the temperature control can be conducted so that the temperature of electronic components is brought close to the set temperature of the target test.

Apparatus for handling electronic components and method for controlling temperature of electronic components

A device holding apparatus comprising a base plate; a hollow pad guard provided on the base plate; a pad pin inserted to the pad guard movably in an axis direction and having a through hole; a pad provided at a tip of the pad pin and having a through hole connected to the through hole of the pad pin; and a bellows pad provided on the base plate, having a through hole connected to the through hole of the pad pin and being elastic in the axis direction; for holding by suction a device by the pad by applying a negative pressure to the through hole of the bellows pad, the through hole of the pad pin and the through hole of the pad.

Holding apparatus

An electric device testing apparatus comprises a connection terminal to which an IC chip to be tested is removably connected, a pusher for pushing the IC chip in the direction of the connection terminal in order to connect the IC chip to the connection terminal, and temperature adjusted air supply for blowing a temperature adjusted air to around the IC chip during a test on the IC chip via a through hole formed on the pushed.

Electric device testing apparatus

An IC testing apparatus,for performing a test by applying at least a low temperature stress to ICs to be tested comprising a refrigerant cycle,wherein at least a compressor,, condenser,, expansion valve,and evaporator,are connected in this order, and a cold air applying line,having a blower,for supplying heat exchanged cold air by the evaporator,to the ICs to be tested.

IC testing apparatus

A test handler decreases an index time in testing IC devices and improves a positioning accuracy for placing the IC devices on a test position of an IC tester. The test handler includes a turn table having a plurality of openings each of which is equally distanced from the other, and at least one of the openings is positioned right above a test socket provided on the IC tester, a plurality of carrier modules attached to the corresponding openings of the turn table where each of the carrier modules has a center opening to receive an IC device to be tested, and a press mechanism provided above the test socket of the IC tester to press the IC device in the carrier module downward so that pins of the IC device contact the test socket. The center opening of the carrier module has tapered walls at the periphery thereof where an upper portion of the center opening is wider than a lower portion of the center opening, and a plurality of guide slits are provided on the tapered walls of the center opening for guiding the pins of the IC device therethrough when the IC device is pressed by the press mechanism.

Test handler having turn table

An improved structure for a spacing frame for interfacing a test head of an IC tester and an IC handler wherein the spacing frame can be changed in a short period of time without moving the test head of the IC tester or the IC handler. The spacing frame and the temperature chamber provide a unique structure which is capable of inserting and replacing the spacing frame within a vertical space in the chamber and locking the spacing frame in the predetermined position in the chamber. The spacing frame structure includes a spacing frame body to interface the IC handler and the IC tester which has a socket guide at its top which is horizontally extended from the body and a flange at its middle portion, a temperature chamber having an opening for receiving said spacing frame body therein, a performance board connected to a bottom of the spacing frame body for providing electric signals from the IC device to be tested to the IC tester, an IC socket for receiving the IC device to be tested therein, and a locking mechanism to provide a vertical movement to the spacing frame body such that the spacing frame body is free when it is in an upper position and is locked when it is in a lower position.

Spacing frame structure for IC handler

transport mechanism for integrated circuit (IC) handlers with four transport stations spaced 90.degree. apart on one circumference are supported by a cross-shaped contact arm, and below the circumference, contact-in, contact or test and contact-out stages are provided at intervals of 90.degree.. Each transport station has a vertically movable air chuck unit and an air chuck driving mechanism for driving the air chuck unit vertically and holding by suction and releasing devices under test. The transport station that has reached a predetermined position above the contact-in stage presses the air chuck unit down with the air chuck driving mechanism and suck and lifts the devices to be tested off the contact-in stage. In parallel with the operation at the contact-in stage, the transport station, staying above the contact or test stage, lowers the air chuck unit which holds devices to be tested and fixes them onto the contact or test stage to start testing them, and the transport station above the contact-out stage lowers the air chuck unit holding tested devices and releases them onto the contact-out stage, thereafter raising the empty air chuck unit. Each time the contact arm is turned 90.degree., these operations are repeated.

Transport mechanism for IC handlers

A vertical drive unit is mounted on a fixed beam provided above a performance board for testing IC elements and fixed to a support frame. An X-Y carrier head of an X-Y transport unit mounted on the support frame is movable in a planar area including space between the vertical drive unit and the performance board. The X-Y carrier head has a vertical guide, by which an air chuck for sucking up and holding an IC element is supported so that it is movable in the vertical direction. The X-Y carrier head is brought to a predetermined position above the test head, the air chuck is brought down by the vertical drive unit, and then terminals of the IC element are pressed into contact with an IC socket on the performance board at a predetermined pressure.

IC test equipment

In a safety device for an IC handler in which a carrier arm and a carrier head, which carry IC elements to testing stations and carry tested IC elements from said testing stations to another position, are covered with covers for safety in such a manner that they can freely be opened and closed, a cover lock mechanism for locking the covers in their closed state and a cover unlock switch are provided. When it is detected, in the ON state of the cover unlock switch, that the IC handler is not in operation, the cover lock mechanism is unlocked by the detected output and the drive current to a motor for driving the carrier arm and the carrier head is cut off, and then it is displayed that the covers may be opened.

Safety device for an IC handler and method for its operation

An IC element supplied to a testing station is guided by a rail and a guide member to move by its own weight. At least one of the rail and guide member has built therein plate-shaped ceramic heater or plate-shaped silicone rubber heater. The guide member urges the IC element against the rail to heat the IC element. An auxiliary stopper is provided opposite but aslant to the IC element sliding surface of the rail. The IC element moving on the rail is yieldingly urged by the auxiliary stopper against the sliding surface of the rail, braked and engages an engaging piece at the lower end of the auxiliary stopper. The IC element is disengaged from the engaging piece to slightly move and stopped by a main stopper, where the IC element is tested. A plurality of such testing passages are provided, and IC elements simultaneously tested in the testing passage are fed to discharge rails respectively corresponding thereto. A plurality of sorting rails are provided in a manner to be movable in the direction of arrangement of the discharge rails, and the spacing of the discharge rails and the spacing of the sorting rails are selected equal to each other so that the IC elements on the discharge rails are simultaneously transferred to the sorting rails. The sorting rails move in a direction in which a plurality of receiving passages of an unloader are arranged at intervals different from those of the sorting rails. One of the sorting rails is selectively connected to one of the receiving passages according to the test results, feeding the IC element on the rail to the unloader.

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Tokyo, Japan

Noriyuki Igarashi