Hitachi, Ltd.

Noriyuki Ashiwake

Takahiro Daikoku

Shigeo Ohashi

Makoto Kitano

Yoshihiro Kondo

Tsuyoshi Nakagawa

Toshio Hatada

Takashi Naganawa

Rintaro Minamitani

Kenichi Kasai

Shizuo Zushi

Yuji Yoshitomi

Tadakatsu Nakajima

Atsuo Nishihara

Akio Idei

Shigeyuki Sasaki

Keizou Kawamura

Nobuo Kawasaki

Fumiyuki Kobayashi

Toshiki Iino

Toshio Hatsuda

Hideyuki Kimura

Keizo Kawamura

Yasuo Ohsone

Shinji Tanaka

Kazuo Sato

Yukio Honda

Takeshi Harada

Tetsuya Hayashida

Wataru Nakayama

Heikichi Kuwahara

Mitsuo Miyamoto

Hiroshi Inouye

Atsushi Morihara

Mitsuhiro Shikida

Satomi Kobayashi

Mitsuru Honma

Sohji Sakata

Toshio Otaguro

A liquid cooling system having a circulator for circulating a cooling liquid therethrough including an input portion for receiving the cooling liquid and a separate output portion for supplying the cooling liquid. A heat receiving jacket supplied with the cooling liquid from the circulator and positioned to received heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the circulation means so that the cooling liquid circulates within a closed flow passage. An accumulating portion is further formed within a portion of the closed flow passage for accumulating the cooling liquid therein.

Liquid cooling system and personal computer using thereof

A liquid cooling system which is utilizable in a personal computer includes a pump for supplying a cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a passage for circulating the cooling liquid passing through the heat radiation pipe into the pump. The heat radiation pipe is made of material having a corrosion resistance that is higher than that of the heat receiving jacket.

Liquid cooling system and personal computer using the same

A liquid cooling system includes a pump for supplying a cooling liquid including water, a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the pump. Different parts of the liquid cooling system are provided with different corrosion resistance against the cooling liquid.

A liquid cooling system for cooling a high heat generating body, such as a semiconductor element or the like, of the type used in an electronic apparatus that is small and thin in size, or in a personal computer equipped with such a structure therein. The system has a pump of the reciprocal movement type, a heat receiving jacket, a heat radiation pipe, and a connector pipe for connecting those parts with one another so as to form a closed loop filled with a cooling liquid. In the system, &Dgr;Vs is equal to or greater than &Dgr;Vp, wherein the inner volume change when the pump emits pulsation therefrom is &Dgr;Vp, the pressure caused by the volume change is P, and the volume change due to the pressure P that occurs in flow passage of the cooling liquid &Dgr;Vp other than within the pump, is &Dgr;Vs.

A liquid cooling system for a personal computer is suitable for cooling a semiconductor device, etc, generating high heat and is designed to suppress undesirable influence on the personal computer following corrosion in the liquid cooling system, thereby ensuring the dependability of the system as a whole. The liquid cooling system has a pump for supplying cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body; a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket; and a passage for circulating the cooling liquid passing through the heat radiation pipe into said pump. The heat radiation pipe is made of a material having a corrosion resistance that is higher than that of the heat receiving jacket.

An electronic apparatus has a water-cooling system suited for a construction having compact, thin design. In the electronic apparatus, a water-cooling jacket is thermally connected to a heat-generating element, a heat-dissipating pipe is thermally connected to a heat-dissipating metal sheet provided at a rear panel of a display case, and a cooling medium liquid is circulated between the water-cooling jacket and the heat-dissipating pipe by a liquid-moving device. A necessary and sufficient circulating flow rate and a necessary discharge pressure are determined by the relation between the upper limit temperature of the heat-generating element and the limit amount of heat dissipation from the surface of the housing. With this structure, heat occurring in the heat-generating element can be dissipated from the rear surface of the display case due to the necessary and sufficient liquid-circulating flow rate.

Electronic apparatus

It is an object of the invention to provide a cooler of an electronic apparatus capable of keeping semiconductor chips at a low temperature without care of condensation and which is excellent in compactness. To achieve the above object, the present invention proposes an electronic apparatus in which a heating region is built in the multilayered wiring substrate of the semiconductor package or module on the side near to the input/output pins, the semiconductor package or module and the cooler mounted on the package or module are placed in a moisture proof case, a heat insulating material is filled in the gaps between the moisture proof case, semiconductor package or module and cooler, and a heater is provided on the outer periphery of the heat insulating material.

There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.

Liquid-cooled electronic device

Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.

Low thermal resistant, fluid-cooled semiconductor module

A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.

Cooling device of multi-chip module

The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.

Semiconductor module

A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

Cooling apparatus of electronic devices

A cooling device according to the present invention, in which a space is formed by means of flat electrodes and side plates disposed on the ends of the flat electrodes, and a flexible film fastened in that space in a shape of the letter S, is fixed to a semiconductor package so that one of the flat electrodes is fitted on the semiconductor package. The respective flat electrodes are alternately powered to move the S shaped section of the flexible film.

Cooling device for semiconductor packages, having flexible film heat

An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.

Growing community of inventors

Tsuchiura, Japan

Noriyuki Ashiwake