Sumitomo Chemical Company, Limited

Noriyuki Arai

Yutaka Shiomi

Hiroshi Nakamura

Noriaki Saito

Masatsugu Akiba

Satoshi Nagano

Provided is an aromatic polysulfone resin composition comprising 5 to 50 parts by weight of a liquid crystal polyester resin having a flow temperature of 250 to 320&deg; C., based on 100 parts by weight of an aromatic polysulfone resin having a melt viscosity of less than 500 Pa&middot;s measured at 340&deg; C. and a shear rate of 1000/second and a molded article thereof. The composition shows excellent flowability in molding without losing excellent mechanical property and heat-resistance of the molded article thereof.

Aromatic polysulfone resin composition and molded article thereof

Provided is an epoxy resin composition comprising a crystalline epoxy resin and an amorphous epoxy curing agent, wherein the crystalline epoxy resin is dispersing uniformly in the amorphous epoxy curing agent as crystallites. The epoxy resin composition is excellent in preservation stability.

Epoxy resin composition and process for producing the same

Provided is an epoxy resin composition comprising a crystalline epoxy resin (A) and an amorphous epoxy resin as an essential component, wherein the crystalline epoxy resin (A) being uniformly dispersed in the amorphous epoxy resin (B) as a crystallite. The epoxy resin composition has a high softening point, hardly causes blocking during the storage and has an excellent handling property.

Epoxy resin composition and method for producing the same

An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential components, the aromatic polyamide pulp (d) being contained in an amount of 0.5 to 10% by weight based on the total weight of the component (a), the component (b) and the component (d), and the inorganic filler (e) being contained in an amount of 75 to 94% by weight based on the total weight of the component (a), the component (b), the component (c) and the component (e), and a semiconductor device sealed with the above epoxy resin composition. The cured product of the epoxy resin composition is good in balance of hot impact strength and hot flexural strength and hence, the semiconductor device sealed with the epoxy resin composition is excellent in soldering resistance.

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Tokyo, Japan

Noriyuki Arai