Koki Company Limited

Sankyo Company, Limited

Origin Company, Limited

Noriyoshi Uchida

Atsushi Hattori

Masahiro Kitaoka

Kazuhiro Yukikata

Takeshi Yahagi

Takayuki Suzuki

Masami Miura

Takeshi Shirai

Naoto Ozawa

Kouhei Furuya

Mitsuyasu Furusawa

Tsuyoshi Hosoya

Arisa Shiraishi

Yuri Misumi

Motohide Sasaki

Yukiko Hayashi

Mitsuyo Takahashi

Duck-Soo Jang

Ju-Heung Kim

Ho-Won Seok

A flux according to the present invention is a flux used for soldering that includes: a thixotropic agent including a polyamide compound that has UV absorption at the wavelength range of 240 to 500 nm in UV-visible absorption spectra; and a solvent including a glycol ether-based solvent.

Flux and solder paste

An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.

Flux and solder material

A flux includes a solvent and a thixotropic agent, the solvent including a carboxylic acid that is liquid at ordinary temperature.

Provided is a solder composition including a flux, a solder alloy, and a silicone oil. The solder composition can have a kinematic viscosity at 25&#xb0; C. of 5000 mm/s or more and 200,000 mm/s or less. The silicone oil can be at least one member selected from the group consisting of dimethyl silicone oil, methylphenyl silicone oil, methylhydrogen silicone oil, reactive silicone oil, and non-reactive silicone oil.

Solder composition

Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.

Solder paste containing solder powder and flux

It is an object of the present invention to provide flux and a solder material of which the activity hardly decreases even at a high temperature and which can also suppress the occurrence of migration. Flux containing an isocyanuric acid derivative containing two or more carboxyl groups and the like are provided.

The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.

Solder paste for reduction gas, and method for producing soldered product

Isolated cultures of Pestalotiopsis funerea IFO 5427 and Pestalotiopsis neglecta FERM BP-3501 are provided. The cultures produce a glucoamylase which digests starch.

Isolated cultures of Pestalotiopsis funerea IFO 5427 and Pestalotiopsis

A Phospholipase A1 which is capable of hydrolyzing a phospholipid to produce a 2-acyl lysophospholipid and is obtainable from species of the fungus Aspergillus.

Phospholipase A1, process for its preparation and the use thereof

A method is provided for preparing a Phospholipase A1 which comprises (a) culturing a Phospholipase A1 producing strain of Aspergillus under conditions which allow for the production of the Phospholipase A1; (b) after the culturing, diluting the culture with water or an appropriate buffer solution; (c) filtering the resulting solution under pressure to remove any insoluble matter; and optionally (d) purifying the enzyme.

Growing community of inventors

Tokyo, Japan

Noriyoshi Uchida