Sii Semiconductor Corporation

Noriyoshi Higashi

Koji Tsukagoshi

An optical sensor device includes a resin sealing portion for sealing an optical sensor element fixed to an element-mounting portion. The resin sealing portion is constituted of a resin having mixed and dispersed therein a glass filler obtained by pulverizing a phosphate-based glass which has spectral luminous efficacy properties by composition adjustment and high heat resistance and weatherability. The optical sensor device is highly reliable and capable of accommodating size and thickness reductions in packages and has stable and hardly changeable spectral luminous efficacy properties.

Optical sensor device

An optical sensor device comprises an element-mounting portion, an optical sensor element provided on the element-mounting portion, a lead having a first contact region connected to the optical sensor element and a second contact region for an external connection, and a resin-encapsulating portion which covers at least a light-receiving plane of the optical sensor element. The resin-encapsulating portion comprises a resin and a glass filler including borosilicate glass dispersed in the resin. The transmissivity of the resin-encapsulating portion in one example is equal to or more than 40% in a wavelength range between 300 nm to 400 nm, and in another example is equal to or more than 60% in a wavelength range between 300 nm and 350 nm.

Optical sensor device and method of manufacturing optical sensor device

The following configuration is adopted in order to provide a highly reliable optival sensor device which enhances the reliability of devices without making the devices unsuitable for size and thickness reductions. The light sensor comprises an element-mounting portion () having a cavity and a lid member closely attached thereinto, the lid member being composed of: a window () constituted of a phosphate-based glass to which properties approximate to a spectral luminous efficacy properties have been imparted by compositional control; and a frame () constituted of a phosphate-based glass having light-shielding properties. The lid member is a Laminated glass member obtained by cutting the phosphate-based glass having the spectral luminous efficacy properties into individual pieces, fitting the glass piece into the opening of the phosphate-based glass () having light-shielding properties, the opening having been formed so as to have a size approximately equal to the cavity size, and melting and integrating the glasses member.

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Osaka, Japan

Noriyoshi Higashi