Dow Corning Toray Silicone Company Limited

Toray Silicone Company Limited

Noriyasu Yokoyama

Yoshitsugu Morita

Keiji Yoshida

Katsutoshi Mine

Kimio Yamakawa

Atsushi Sakuma

Atsushi Sasaki

A thermally conductive silicone rubber composition comprised of (A) 100 parts by weight of an organopolysiloxane that contains at least two silicon-bonded alkenyl groups per molecule, (B) 0.1 to 50 parts by weight of an organohydrogenpolysiloxane that contains at least two silicon-bonded hydrogen atoms molecule, (C) 0.1 to 10 parts by weight of organosiloxane that contains at least one silicon-bonded alkoxy group per silicon-bonded hydroxyl per molecule, (D) 300 to 1200 parts by weight of fine alumina powder comprised of (i) 5 to 95 wt % of spherical or nonspherical fine powder of an average particle diameter of up to 10 .mu.m and of (ii) 95 to 5 wt % of spherical or nonspherical fine alumina powder of an average particle diameter of 10 to 50 .mu.m, and (E) a catalytic quantity a hydrosilylation reaction catalyst.

Thermal conductive silicone rubber composition

A silicone-modified water-based coating composition is disclosed wherein a suspension of silicone rubber particles in water is added to a water-based coating composition such that the resulting system is storage-stable and forms a mat film when dried or cured, which film is soft to the touch.

Silicone-modified water-based coating composition

The instant invention pertains to a curable resin composition comprised of A) 100 parts by weight curable resin, and B) 0.1-500 parts by weight of an organopolysiloxane having organic groups that contain epoxy groups, which is expressed by the formula: ##STR1## wherein R.sup.1 is a univalent hydrocarbon group excluding alkenyl groups, R.sup.2 is a hydrogen atom or a univalent hydrocarbon group excluding alkenyl groups, R.sup.3 is an alkoxysilylalkyl group or an organic group that contains epoxy groups, a is 0 or a positive integer, b is a positive integer and c is a positive integer, where a/c has the value of 0 to 4, b/c has the value of 0.05 to 4 and (a+b)/c has the value of 0.2 to 4. The curable resin composition of the instant invention has superior flowability that produces a hardened resin with superior flexibility and adhesion.

Curable resin composition

Cured silicone powder and process for the preparation thereof

A method for the preparation of a powder mixture of cured silicone microparticles and inorganic microparticles is disclosed, said method comprising (I) forming a water-based suspension of (A) a plurality of cured silicone microparticles having an average diameter of 0.1 to 200 micrometers, (B) a plurality of inorganic microparticles having an average particle diameter of 0.1 to 200 micrometers and, optionally, (C) at least one surfactant; and (II) removing the water from said water-based suspension. The resultant powder mixture is relatively free from agglomeration and may be easily dispersed in organic resins to form a homogeneous mixture for such applications as paints and coatings.

Method for the preparation of a powder mixture composed of cured

The present invention relates to a silicone rubber microsuspension which has an excellent high-concentration storage stability, and to a method for the preparation of a silicone rubber microsuspension. The silicone rubber microsuspension comprises a microparticulate silicone rubber having an average particle diameter not exceeding 10 micrometers, a nonionic surfactant whose HLB value is less than 10, a nonionic surfactant whose HLB value is at least 10, and water, with the proviso that the content of the microparticulate silicone rubber in the silicone rubber microsuspension is at least 50 weight percent. The method for the preparation of said silicone rubber microsuspension comprises mixing a liquid silicone rubber composition, a nonionic surfactant having an HLB value of less than 10, a nonionic surfactant having an HLB value of at least 10, and water.

Silicone rubber microsuspension and method for its preparation

The curable resin composition of the present invention consists of a curable resin having uniformly dispersed therein particles of a cured silicone rubber obtained from an organosiloxane composition curable by a platinum-catalyzed hydrosilation reaction, wherein said organosiloxane composition contains reaction products of an ethylenically unsaturated epoxy compound and an ethylenically unsaturated aromatic compound with the organohydrogenpolysiloxane present in said organosiloxane composition. Either or both of the epoxy compound and the aromatic compound can be prereacted with a portion of the silicon-bonded hydrogen atoms of the organohydrogenpolysiloxane.

Curable resin composition containing dispersed particles of a cured

The curable resin composition of the present invention consists of a curable resin and the spherical microparticles of cured silicone rubber obtained by the curing of an addition reacting silicone rubber composition, wherein the silicone rubber composition also contains an epoxy compound having an aliphatically unsaturated group. Furthermore, because the microparticles are prepared from an aqueous emulsion or aqueous dispersion of the silicone rubber composition, it has an extremely small particle size.

Growing community of inventors

Tokyo, Japan

Noriyasu Yokoyama