Sanyo Denki Co., Ltd.

Aisin Seiki Kabushiki Kaisha

Noriyasu Sasa

Toshiki Ogawara

Michinori Watanabe

Haruhisa Maruyama

Yuji Iwata

A heat sink-equipped cooling apparatus capable of exhibiting increased cooling performance and durability and being reduced in dimensions in a radial direction thereof. A heat sink includes a radiation fin unit including a plurality of radiation fins arranged so as to surround a virtual central line while keeping a center thereof aligned with the central line. A cooling fan includes an impeller including a plurality of blades and rotated through a motor. The cooling fan is mounted on the heat sink in such a manner that the impeller is positioned above the radiation fin unit of the heat sink. The radiation fins each are inclined with respect to a virtual vertical plane so as to form a predetermined inclination angle &thgr; therebetween. The inner edges of the radiation fins are connected in a manner to be heat-transferable or in a manner that a thermally conductive passage is formed between the inner edges.

Heat sink-equipped cooling apparatus

A heat sink-equipped cooling apparatus capable of exhibiting increased cooling performance and durability and being reduced in dimensions in a radial direction thereof. A heat sink includes a radiation fin unit including a plurality of radiation fins arranged so as to surround a virtual central line while keeping a center thereof aligned with the central line. A cooling fan includes an impeller including a plurality of blades and rotated through a motor. The cooling fan is mounted on the heat sink in such a manner that the impeller is positioned above the radiation fin unit of the heat sink. The radiation fins each are inclined with respect to a virtual vertical plane so as to form a predetermined inclination angle &thgr; therebetween.

A thermoelectric cooling module, in which an electronic device is cooled due to the Peltier effect of P-type and N-type thermoelectric semiconductor elements, comprising a heat radiating section which comprises a heat radiating electrode having a fin-shaped portion for heat radiation integrally formed, a heat absorbing section comprising heat absorbing electrode contacted with the electronic device, and a thermoelectric conversion section comprising the P-type and N-type thermoelectric semiconductor elements interposed between the heat radiating electrode and the heat absorbing electrode.

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Hokkaido, Japan

Noriyasu Sasa