Sanyo Electric Co., Ltd.

Noriyasu Sakai

Toshihiko Higashino

Kouji Seki

Noriaki Sakamoto

Yoshiyuki Kobayashi

Kouji Takahashi

Eiju Maehara

Kazuhisa Kusano

Hitoshi Takagishi

Yusuke Igarashi

Masato Noguchi

In order to prevent, in a resin sealing step, a conductive foilfrom locally rising because of concentration of air intervening between the conductive foiland lower moldA due to the charged pressure, a method for manufacturing circuit devices is provided. The method for manufacturing circuit devices includes the step of forming conductive patterns, which form a plurality of mounting portionsof a circuit elementon a conductive foil, in each block, the step of disposing the circuit elementon each mounting portionof the conductive patternin each block, the step of performing resin sealing by bringing the lower moldA having an air ventinto contact with the backface of the conductive foilin each blockand by performing transfer molding with an insulating resinwhile disposing each mounting portionof the blockin the same cavity, and the step of separating each mounting portionby dicing.

Method for manufacturing circuit devices

The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device, shielding lids, andare disposed at upper and lower parts of a ring illuminationand at a lower part of lens barrel. Shimmerof nitrogen gas that blows out from a working holecan thus be prevented from entering inside ring illumination, especially by shielding lidat the lower part of ring illumination. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the &#x3bc;m order can be improved.

Recognition device, bonding device, and method of manufacturing a circuit device

The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding deviceprovided with recognition device, a shimmer prevention blow mechanismis disposed between a ring illuminationand a working holeand near working hole. Though the nitrogen gas that blows out from working holegives rise to shimmer due to temperature difference, this shimmer can be blown away by the nitrogen gas blow from shimmer prevention blow mechanism. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the &#x3bc;m order can be improved.

The semiconductor elements for the small signal type circuits and the Au wire for connection are integrated as one package to produce the semiconductor devicesA,A,A,A and. In this way, the wire bonding of Au can be omitted, and the wire bonding of the small diameter Al wire and the large diameter Al wire is only required to complete the connection of the fine metal wire. These semiconductor devices have a plurality of circuit elements as one package, so that the mounting operation on the mounting board can be significantly reduced.

Hybrid integrated circuit device

The present invention solves a problem with a wire bonding device, that during a wire bonding process, a cover at the periphery of a working hole warps upward to cause inadvertent sparking to occur across the cover that has warped upwards and a torch electrode. This invention's bonding device provided with recognition device is characterized in that insulation treatment is applied to a part of a cover positioned at the periphery of a working hole . The interior of a working region is kept, for example, at 230&deg; C. by a heater inside a setting base , and by being placed under high temperature constantly, a part of cover warps upwards. However, since insulation treatment is applied to part of cover , a bonding device can be realized with which inadvertent sparking between a torch electrode will not occur.

Bonding device

The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device , shielding lids , and are disposed at upper and lower parts of a ring illumination and at a lower part of lens barrel . Shimmer of nitrogen gas that blows out from a working hole can thus be prevented from entering inside ring illumination , especially by shielding lid at the lower part of ring illumination . As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the &mgr;m order can be improved.

The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device provided with recognition device, a shimmer prevention blow mechanism is disposed between a ring illumination and a working hole and near working hole . Though the nitrogen gas that blows out from working hole gives rise to shimmer due to temperature difference, this shimmer can be blown away by the nitrogen gas blow from shimmer prevention blow mechanism . As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the &mgr;m order can be improved.

Growing community of inventors

Gunma, Japan

Noriyasu Sakai