Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Noriyasu Echigo

Masaru Odagiri

Kazuyoshi Honda

Nobuki Sunagare

Shinichi Suzawa

Kiyoshi Takahashi

Takanori Sugimoto

Tatsuaki Ishida

Ryuji Sugita

Yoshiaki Kai

Toru Miyake

Tomohiro Okumura

Hiroyuki Yamakita

Hideyuki Ueda

Mitsuo Saitoh

Mikio Murai

Keisuke Okada

Junko Asayama

Kenji Kuwahara

Kiyosi Takahasi

Hiroyuki Hasegawa

Kazuo Iwaoka

Hisaaki Tachihara

Jun Katsube

Tomonori Sato

Hideki Matsuda

A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.

Thin film, method and apparatus for forming the same, and electronic component incorporating the same

There are provided a PDP having a higher luminous efficiency and a process for producing the same. In a plasma display panel filled with a discharge gas between a front plate and a rear plate opposed to each other, the front platecomprises a glass substrate, electrodes(transparent electrodesand bus electrodes) on the glass substrate, the first dielectric layercovering the electrodesand the glass substrateand containing a fluorine atom, the second dielectric layercovering the first dielectric layerand containing a fluorine atom at a less amount than that in the first dielectric layer, and a protective layercovering the second dielectric layer

Plasma display panel and process for producing the same

Electrode layers () are arranged on both sides of a dielectric layer () facing each other so as to configure a capacitor. Lead electrodes () are formed in the electrode layers (). A penetrating electrode () that is insulated from the electrode layers () is formed. An electronic component () configured in this manner is mounted on a wiring board, and a semiconductor chip can be mounted thereon. Along with connecting the semiconductor chip to the wiring board via the penetrating electrode (), the semiconductor chip or the wiring board is connected to the lead electrodes (). In this manner, while suppressing the size increase of a mounted area, the capacitor or the like can be arranged near the semiconductor chip. Thus, the semiconductor chip is driven with high frequency more easily.

Method for fabricating semiconductor component

The present invention provides a bis(4-mercaptophenyl) sulfide derivative represented by general formula 1. This derivative is a monomer that can form a dielectric film suitable for an electronic component. The present invention further provides a method for producing this derivative and an electronic component having high characteristics under excellent humidity and high temperature.

Capacitor comprising bis(4-mercaptophenyl) sulfide derivative

A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &#x3bc;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &#x3bc;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.

Layered product and capacitor

A method for producing a laminate having resin layers and thin metal layers by repeating a process unit comprising a step of laminating a resin layer by applying a resin material, a step of depositing a patterning material on the resin layer and a step of laminating a thin metal layer, predetermined times on a turning support (), wherein the patterning material is stuck on the surface of the resin layer in a noncontact way. A laminate comprising a large number of laminate units each comprising a resin layer and a thin metal layer divided at an electric insulation stripe part can be produced stably. The laminate is applicable to production of a high performance small capacitor at low cost.

Layered product, capacitor and a method for producing the layered product

Resin thin films ( ) and metal thin films ( ) are layered in alternation. The metal thin films are set back from the peripheral edges of the resin thin films ( ). Via holes ( ) penetrating the layered product in the layering direction are formed and filled with conductive material ( ). The conductive material ( ) electrically connects the metal thin films ( ) among one another. The metal thin films are not exposed at the periphery, so that corrosion of the metal thin films is not likely to occur. Furthermore, cutting of the metal thin films during the manufacturing process is avoided.

Layered product, capacitor, electronic component and method and apparatus manufacturing the same

A layered product including a plurality of deposition units, each having a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.

A layered product comprising a plurality of deposition units, each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1 &mgr;m or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1 &mgr;m or below. The surface characteristics are improved regardless of the thickness of the layered product and the requirement of high performance thin film can be satisfied because the layered product contains no foreign matter. The layered product is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.

A method for producing a laminate having resin layers and thin metal layers by repeating a process unit comprising a step of laminating a resin layer by applying a resin material, a step of depositing a patterning material on the resin layer and a step of laminating a thin metal layer, predetermined times on a turning support ( ), wherein the patterning material is stuck on the surface of the resin layer in a noncontact way. A laminate comprising a large number of laminate units each comprising a resin layer and a thin metal layer divided at an electric insulation stripe part can be produced stably. The laminate is applicable to production of a high performance small capacitor at low cost.

Growing community of inventors

Kobe, Japan

Noriyasu Echigo