Matsushita Electric Industrial Co., Ltd.

Noriya Sato

Hiromi Sakita

Hiromitsu Taki

Katsuhiko Honjo

Kazuhiro Takeda

Kenzou Isozaki

An inductance device wherein a conductor film is formed on a base, grooves are formed in the conductor film, a protective material is disposed on the grooves, and a length L1, a width L2 and a height L3 of the inductance device satisfy-the following relation:

Wireless terminal equipment including electric component having

An inductance device wherein a conductor film is formed on a base, grooves are formed in the conductor film, a protective material is disposed on the grooves, and a length L1, a width L2 and a height L3 of the inductance device satisfy the following relation:

Electric component having conductor film formed on insulative base

This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.

Electrode on heat-resisting and isolating substrate

This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % and the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.

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Miyazaki-ken, Japan

Noriya Sato