Canon Kabushiki Kaisha

Noritake Tsuboi

Mitsutoshi Hasegawa

Satoru Higuchi

Tomohisa Ishigami

Koji Noguchi

Takashi Aoki

Yuya Karakawa

A wiring component includes a first wiring portion including a plurality of wirings arranged side by side in a first direction, a second wiring portion including a plurality of wirings arranged side by side in a second direction, and a coupling portion configured to couple the first wiring portion and the second wiring portion to each other, wherein an angle formed by the first direction and the second direction is changeable by deformation of the coupling portion.

Wiring component, module, apparatus, and method for manufacturing module

An electronic module includes a first wiring component, a first electronic component, a first bonding member, and a second bonding member. The first wiring component includes a first pad, a second pad, and a first insulating member. The first pad, the second pad, and the first insulating member are formed in a first mounting surface. The first electronic component includes a first electrode and a second electrode and is surface-mounted on the first mounting surface. The first bonding member is configured to bond the first pad and the first electrode together. The second bonding member is configured to bond the second pad and the second electrode together. The first electrode and the second electrode are positioned on an insulating area of the first mounting surface. A distance between the first electrode and the first insulating member is smaller than a distance between the first electrode and the first pad.

Electronic module, electronic apparatus, and method of manufacturing the electronic module

An electronic module includes a first wiring board, a second wiring board, and an intermediate connection member. The intermediate connection member includes an insulator, a plurality of first wirings supported by the insulator and arranged at intervals in a second direction intersecting a first direction, a plurality of second wirings supported by the insulator and arranged at intervals in the second direction, and a metal layer supported by the insulator and interposed between the plurality of first wirings and the plurality of second wirings so as to oppose the plurality of first wirings and the plurality of second wirings in a third direction intersecting the first direction and the second direction. A part of the metal layer sandwiched in the insulator is bonded to one of the first wiring board or the second wiring board by a conductive first bonding member.

Electronic module, intermediate connection member, and electronic device

A printed circuit board includes a first chip component, a second chip component, and a printed wiring board. The first chip component and the second chip component each has a length L2 in the longitudinal direction. A relationship of 0.894≤L2/L1≤1.120 is satisfied, where L1 represents a length of the first opening in the longitudinal direction. A relationship of 0.894≤L2/L4≤1.120 is satisfied, where length L4 represents a length of the second opening in the longitudinal direction. A relationship of 0.183≤L/L≤0.309 is satisfied, where Lrepresents a length of the first land in the longitudinal direction, and Lrepresents a thickness of solder on an end surface of the first electrode. A relationship of 0.183≤L/L≤0.309 is satisfied, where Lrepresents a length of the second land in the longitudinal direction, and Lrepresents a thickness of solder on an end surface of the second electrode.

Printed circuit board and electronic device

An intermediate connection member includes a first insulating substrate portion, a second insulating substrate portion, an insulating layer portion provided between the first insulating substrate portion and the second insulating substrate portion and formed from a different material from the first insulating substrate portion and the second insulating substrate portion, a plurality of first wiring portions provided between the first insulating substrate portion and the insulating layer portion so as to extend in a first direction such that both end portions of the plurality of first wiring portions in the first direction are exposed to an outside, and a plurality of second wiring portions provided between the second insulating substrate portion and the insulating layer portion so as to extend in the first direction such that both end portions of the plurality of second wiring portions in the first direction are exposed to the outside.

Intermediate connection member, method for manufacturing intermediate connection member, electronic module, method for manufacturing electronic module, and electronic equipment

A module includes a first wiring board, a first integrated circuit component mounted on the first wiring board, a second wiring board overlapping with the first wiring board, a second integrated circuit component mounted on the second wiring board, and a connection member disposed between the first wiring board and the second wiring board and configured to electrically connect the first wiring board and the second wiring board, wherein the second integrated circuit component overlaps with the first wiring board and supplies power to the first integrated circuit component via the connection member.

Module and equipment

A semiconductor module includes a semiconductor device having a first land, a second land, and a third land, a wiring board having a substrate, and a fourth land, a fifth land, and a sixth land disposed on the main surface of the substrate, a chip component having a first electrode and a second electrode disposed across a distance in the longitudinal direction and being disposed between the wiring board and the semiconductor device, a first solder joint for bonding the first land, the fourth land, and the first electrode, a second solder joint for bonding the second land, the fifth land, and the second electrode, and a third solder joint for bonding the third land and the sixth land. The volume of the first solder joint and the volume of the second solder joint are each larger than the volume of the third solder joint.

Semiconductor module and electronic apparatus

A printed circuit board includes a first chip component, a second chip component, and a printed wiring board. The first chip component and the second chip component each has a length L2 in the longitudinal direction. A relationship of 0.894&#x2264;L2/L1&#x2264;1.120 is satisfied, where L1 represents a length of the first opening in the longitudinal direction. A relationship of 0.894&#x2264;L2/L4&#x2264;1.120 is satisfied, where length L4 represents a length of the second opening in the longitudinal direction. A relationship of 0.183&#x2264;L/L&#x2264;50.309 is satisfied, where Lrepresents a length of the first land in the longitudinal direction, and Lrepresents a thickness of solder on an end surface of the first electrode. A relationship of 0.183&#x2264;L/L&#x2264;0.309 is satisfied, where Lrepresents a length of the second land in the longitudinal direction, and Lrepresents a thickness of solder on an end surface of the second electrode.

A printed circuit board includes a first chip component, a second chip component, and a printed wiring board. The first chip component and the second chip component each has a length L2 in the longitudinal direction. A relationship of 0.894&#x2264;L2/L1&#x2264;1.120 is satisfied, where L1 represents a length of the first opening in the longitudinal direction. A relationship of 0.894&#x2264;L2/L4&#x2264;1.120 is satisfied, where length L4 represents a length of the second opening in the longitudinal direction. A relationship of 0.183&#x2264;L/L&#x2264;0.309 is satisfied, where Lrepresents a length of the first land in the longitudinal direction, and Lrepresents a thickness of solder on an end surface of the first electrode. A relationship of 0.183&#x2264;L/L&#x2264;0.309 is satisfied, where Lrepresents a length of the second land in the longitudinal direction, and Lrepresents a thickness of solder on an end surface of the second electrode.

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Yokohama, Japan

Noritake Tsuboi