Kyocera Corporation

Noritaka Niino

Yoshimasa Sugimoto

Hiroki Ito

Takuya Hayashi

Yasushi Oode

Shogo Matsunaga

Eri Takeuchi

Kensou Ochiai

Narutoshi Ogawa

Shinichi Kooriyama

Masashi Konagai

Tomoyoshi Akashi

Mitsuharu Sakai

Katsuhiko Fukumoto

Shou Yamasaki

Ko Chishiki

Ryuji Yamada

Shigetoshi Inuyama

Masaya Ochi

A light-emitting member includes an optical fiber that receives first excitation light and first mixed light. The optical fiber includes a first wavelength converter that emits first fluorescence in response to the first excitation light, and emits second mixed light being a mixture of the first mixed light and the first fluorescence through a side surface. The light-emitting member includes a light-emitting portion that emits the second mixed light outside the light-emitting member. A plurality of component light beams of the first mixed light includes first component light with a first peak wavelength and second component light with a second peak wavelength longer than the first peak wavelength. An absolute value of a difference between a first fluorescence peak wavelength of the first fluorescence and the first peak wavelength is less than an absolute value of a difference between the first fluorescence peak wavelength and the second peak wavelength.

Light emitter

A wavelength converter emits light in response to laser light emitted from a light emitter. The wavelength converter includes a surface including a first area to directly receive the laser light from the light emitter, and a second area located on a member. The light emitted from the wavelength converter includes a first component emitted directly from the wavelength converter and input directly into the light receiver, and a second component emitted from the second area, reflected from the member, and input into the light receiver. The member includes a surface including a third area to receive the second component. The third area has a reflectance for the light greater than a reflectance of the wavelength converter for the light in the second area.

Optical connector

A photoconversion device includes a first wavelength converter and a long-pass filter. The first wavelength converter receives excitation light from an output portion and emits fluorescence having a longer wavelength than the excitation light. The long-pass filter transmits the fluorescence emitted by the first wavelength converter and reflects the excitation light transmitted through or reflected from the first wavelength converter to enter the first wavelength converter.

Photoconversion device and illumination system

An RFID tag includes a circuit board, an RFID IC and a functional module. The circuit board has an antenna conductor. The RFID IC is mounted on the circuit board. The functional module is connected to the circuit board through a lead wire. An electrical length of a connection wiring that electrically connects the functional module to an element on the circuit board is within ±10% of an integral multiple of a half wavelength of a radio signal that the RFID IC transmits or receives.

RFID tag

An RFID tag includes an IC for RFID to which information for presentation can be written by wireless communication, a display, and a control circuit configured to output presentation data to the display. The control circuit includes a font repository storing font data and a data processor configured to create the presentation data by using one or more character codes and the font data, the one or more character codes being included in the information for presentation.

A photoconversion device includes a holder, a wavelength converter, and an optical element. The holder holds an output portion that outputs excitation light. The wavelength converter includes an incident surface section including a protruding surface to receive the excitation light from the output portion and emits fluorescence in response to the excitation light incident on the incident surface section. The optical element includes a focal point surrounded by the incident surface to direct the fluorescence emitted by the wavelength converter in a predetermined direction.

An RFID tag includes a circuit board, an RFID IC, a functional module, a case and a lid. The circuit board has a main part and an extended part. The extended part extends along an edge of the main part and includes an antenna conductor. The RFID IC is mounted on the circuit board. The functional module is disposed so as to overlap the circuit board. The case accommodates the circuit board and the functional module. The lid closes an opening of the case. The main part of the circuit board is held at a position away from an inner bottom surface of the case with the functional module as an obstacle in a direction toward the lid.

A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package includes a substrate. The substrate includes a first recess including a first bottom surface on which a light emitter is mountable, and a first step surface having a first connection pad thereon, a second recess including a second bottom surface on which a light receiver is mountable, and a second step surface having a second connection pad thereon. In a direction connecting a center of the first bottom surface and a center of the second bottom surface in a plan view, the first step surface is located outward from the first bottom surface and the second step surface is located outward from the second bottom surface.

Measurement sensor package and measurement sensor

A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package () includes a substrate (), a lid (), and a ground conductor layer (). The substrate () contains a light emitter and a light receiver, and includes a substrate body (), a plurality of ground via conductors (), an frame-shaped ground conductor layer (), signal wiring conductors (), and an external connection terminal (). The ground via conductors () are connectable to a ground potential, and are located outward from a first recess () and a second recess () included in the substrate body () in a plan view.

There are provided an electronic component housing package and the like which have high efficiency of heating by infrared rays. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each contain a first material as a major constituent. The electronic component housing package comprises one or more infrared-ray absorbing layers disposed between the plurality of insulating layers and/or disposed on an upper surface of uppermost one of the plurality of insulating layers. The one or more absorbing layers contain a second material which is higher in infrared absorptivity than the first material.

Electronic component housing package and electronic apparatus

A measurement sensor package and a measurement sensor improve reliability in strength and other aspects. A measurement sensor package includes a substrate, a lid, a ground conductor layer, a metallic thin layer, and a bond. The ground conductor layer and the metallic thin layer are arranged inside the bond that extends continuously as viewed through from above. The bond directly bonds a first main surface of a substrate body and a facing surface of the lid together along the entire periphery. This improves the reliability in strength.

A circuit board includes a metal circuit plate, a metallic heat diffusing plate disposed below the metal circuit plate and having an upper surface and a lower surface, a metallic heat dissipating plate below the heat diffusing plate, an insulating substrate disposed between the metal circuit plate and the heat diffusing plate, and an insulating substrate disposed between the heat diffusing plate and the heat dissipating plate. A grain diameter of metal grains contained in the heat diffusing plate decreases from each of the upper surface and the lower surface of the heat diffusing plate toward a center portion of the heat diffusing plate in a thickness direction.

Circuit board and electronic device

A circuit board includes an insulating substrate; a metal circuit sheet joined to a first principal surface of the insulating substrate; and a heat dissipating sheet made of metal and joined to a second principal surface of the insulating substrate, the second principal surface being opposite the first principal surface. The thickness of the heat dissipating sheet is at least 3.75 times the thickness of the metal circuit sheet. The size of metal grains contained in the heat dissipating sheet is smaller than the size of metal grains contained in the metal circuit sheet, and decreases with increasing distance from the second principal surface of the insulating substrate.

Circuit board having a heat dissipating sheet with varying metal grain size

An electronic device mounting substrate includes: a first wiring substrate shaped in a rectangular frame, an interior of the rectangular frame constituting a first through hole; a second wiring substrate shaped in a rectangular frame or plate, the second wiring substrate being disposed so as to overlie a lower surface of the first wiring substrate and be electrically connected to the first wiring substrate; a metallic plate disposed so as to overlie a lower surface of the second wiring substrate so that the second wiring substrate is sandwiched between the metallic plate and the first wiring substrate; and a lens holder secured to an outer periphery of the metallic plate. A frame interior of the first wiring substrate, or a frame interior of each of the first wiring substrate and the second wiring substrate, constitutes an electronic device mounting space.

Electronic device mounting substrate and electronic apparatus

An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers. The first metal layer contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.

Growing community of inventors

Kirishima, Japan

Noritaka Niino