Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Noritaka Kamimura

Toshio Ogawa

Kazuji Yamada

Masaaki Takahashi

Osamu Ito

Junichi Saeki

Kazuhiro Suzuki

Akihiro Tamba

Makoto Ishii

Toshiaki Kaminaga

Tadamichi Asai

Takao Kobayashi

Yoshishige Endou

Hiromi Isomae

Katsuo Ebisawa

Michio Otani

Masahiro Gouda

Masaki Kamiakutsu

An electronic device has a wiring board mounted with an electronic circuit chip. A recess or through-hole is formed in a major surface of the wiring board on which the electronic circuit chip is mounted at a position corresponding to a central portion of the electronic circuit chip. Air trapped in a space between the electronic circuit chip and the wiring board is collected in the recess or through-hole to form a void separated from the electronic circuit chip.

Electronic device and method of fabricating the same

A semiconductor device includes a main circuit part having a semiconductor device formed on an electrode plate of a lead frame and a control circuit part having protective functions, which is integrally molded by a resin mold part into an integral mold structure.

Semiconductor device including an integrally molded lead frame

The present invention relates to a thick film resistor material which is suitable especially for thick film hybrid IC having conductor, resistor, semiconductor element and the like in which Cu is used as the conductor and furthermore, a thick film resistor composition which can be fired in a reducing atmosphere. The present invention further relates to a thick film hybrid IC using the thick film resistor composition as a resistor and a method for making it.

Thick film resistor composition, hybrid IC using the composition, and

Growing community of inventors

Hitachinaka, Japan

Noritaka Kamimura