Shell Oil Comapny

Norio Tohriiwa

Yasuyuki Murata

Yoshinori Nakanishi

Atsuhito Hayakawa

Mitsukazu Ochi

Yasuyki Murata

An epoxy resin composition which can be crushed at an ordinary temperature and which comprises respective components described below,

Epoxy resin composition and epoxy resin composition for encapsulating

The present invention provides an epoxy resin composition which can provide a cured composite product having a high heat resistance, and an excellent mechanical strength at a high temperature. The present invention provides an epoxy resin composition comprising, as essential components: (a) an epoxy resin; (b) a curing agent for epoxy resins, (c) a silane compound having at least one epoxy group or a group being capable of reacting by addition to an epoxy group in a molecule, and at least two alkoxy groups connected to silicone atom in a molecule, and (d) a catalyst for condensation polymerization of a silane compound, and a cured composite product obtained by curing the composition.

Epoxy resin composition and cured composite product

The process for producing a modified epoxy resin comprises reacting (a) an epoxy resin having at least two epoxy groups per one molecule, and (b) a specific active ester group-containing compound having at least two aromatic ring-bonded active ester groups per one molecule, in proportions such that the amount of the active ester groups in the active ester group-containing compound is from about 0.05 to about 0.95 mol per mole of the epoxy group in the epoxy resin, and the modified epoxy obtained by this process, and a composition of the epoxy resin and a curing agent are encompassed.

Process for producing modified epoxy resin, modified epoxy resin

The present invention relates to a liquid resin composition comprising (1) a liquid epoxy resin, (2) a particular ester curing agent, and (3) a curing accelerator. This epoxy resin composition can provide a cured resin with excellent heat resistance and water resistance, which is particularly useful for encapsulation, casting and adhesion.

Liquid epoxy resin composition

To provide an epoxy resin composition for encapsulation of semiconductors, which is superior in curability and can yield a cured product having low moisture absorption. The epoxy resin composition comprises the following components (a), (b), (c), and (d):

Epoxy resin composition for encapsulation of semiconductors

The invention relates to an epoxy resin composition for semiconductor encapsulation comprising at least an epoxy resin, hardener, inorganic filler, and accelerator, wherein said epoxy resin is one which is composed of about 20 to about 90 parts by weight of 4,4'-bisphenol F type epoxy resin and about 10 to about 80 parts by weight of either a polyhydric phenolic type epoxy resin which has slightly polar hydrocarbon groups (Z) lying between the phenyl nuclei, or a biphenol type epoxy resin.

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Yokkaichi, Japan

Norio Tohriiwa