Hitachi, Ltd.

Norio Sengoku

Fumiyuki Kobayashi

Masahide Okamoto

Tsuyoshi Fujita

Hirayoshi Tanei

Masato Nakamura

Shoichi Iwanaga

Shousaku Ishihara

Kousaku Morita

Nobuaki Ohki

Fumikazu Tagami

Shizuo Zushi

Mitsuo Miyamoto

Tsutomu Imai

Takaji Takenaka

Hiromi Tosaki

Toshitada Netsu

Hiroshi Kozai

Kazutoshi Takahashi

Yoshiaki Horita

Hisato Shirasawa

A semiconductor device-mounting substrate is provided with a semiconductor device, a capacitor device, and a wiring substrate. The wiring substrate has a space in which the capacitor device should be located, and the capacitor device is locate in the space. Terminals of a driving power supply wiring for the semiconductor device are provided on a surface of the space, and the terminals are connected with the capacitor device.

Structure for mounting a semiconductor device and a capacitor device on a substrate

Ceramic circuit substrate which is sintered at 900 to 1,050.degree. C. and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing are provided by using a glass with a softening point of 850 to 1,100.degree. C., that is, a glass having a composition included in an area in FIG. 1 (triangular composition diagram of SiO.sub.2 --B.sub.2 O.sub.3 --R.sub.2 O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively as raw material.

Circuit substrate and manufacture thereof, ceramic composition for

Ceramic circuit substrate which is sintered at 900.degree. to 1,050.degree. C. and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing are provided by using a glass with a softening point of 850.degree. to 1,100.degree. C., that is, a glass having a composition included in an area in FIG. 1 (triangular composition diagram of SiO.sub.2 --B.sub.2 O.sub.3 --R.sub.2 O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively as raw material.

Circuit substrate and electronics computer, using sintered glass ceramics

A first mother board among a plurality of mother boards is mounted adjacent to a reference mother board and a second mother board among said plurality of mother boards is mounted in a position rotated 180.degree. about the horizontal centerline of the second mother board and mounted back to back to the first mother board, whereby the reference mother board and the first and second mother boards can be interconnected at a minimal distance.

Mounting structure for electronic device

In a power supply network network of a printed circuit board, a through hole network for power supply electrically connected to main power supply pads connected with power supply cables is electrically and substantially independent of an internal network comprising networks of power supply layers on the like and a through hold network for load. Thereby, each of source currents supplied from the power supply cables reaches the through hole network for each load, once, via the through hold network for power supply and horizontal buses, therefore the dispersion in the drop of voltage across the main power supply pads and each of the loads is effectively decreased.

Power supply network of printed circuit board

A multilayer printed circuit board having a plurality of printed circuit boards each having opposite surfaces respectively provided with an electric source or ground layer and a signal circuit layer. The plurality of printed circuit boards is stacked through adhesive layers such that the electric source or ground layer and the signal circuit layer are alternately disposed, the characteristic impedance of each signal circuit layer is given by a thickness and material of each of the substrate and the adhesive sheet disposed between the signal circuit layer and one of two electric source or ground layers adjacent to the signal circuit layer and between the same signal circuit layer and the other electric source or ground layer.

Multilayer printed circuit board and method of producing the same

In a multilayer printed circuit board including a signal layer, a power supply layer, and through-holes, the shape of each of clearances formed on a power supply layer for the purpose of attaining insulation from through-holes is nearly a quadrangle having four circular corners. Thereby, the area of the power supply layer left between adjacent clearances is increased to suppress increase in electrical resistance at that portion.

Multilayer printed circuit board

A method of fabricating a multilayer printed-circuit composite in which a plurality of internal layer sheets are stacked in an alternate arrangement with one another and laminated together. The relatively thin and thick internal layer sheets are stacked alternately with adhesive material sheets being interposed between the adjacent internal layer sheets. By melting the adhesive material sheets, the stacked internal layer sheets are laminated together. This structure of the multilayer printed-circuit board is effective for reducing the dimensional changes of the internal layer sheet when compared with the structure composed only of thin internal layer sheets. Thus, the multilayer printed-circuit composite can be realized in a relatively small overall thickness while reducing the dimensional changes of the individual internal layer sheets.

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Hadano, Japan

Norio Sengoku