Mitsubishi Gas Chemical Company, Inc.

Mitsubishi Gas Company, Inc.

Norio Sayama

Kazuyuki Ohya

Akitoshi Sugio

Eiichi Yonemitsu

Masaharu Kimura

Masanobu Masu

Hiromi Nakamura

Takehiko Takahashi

Norio Narazaki

Kazuo Yamamoto

Takeo Kanaoka

Kenji Ishii

Hiroyuki Matsumoto

Yasuo Tanaka

Yoshinori Kondo

Takamasa Kawakami

Masao Okabe

Takanari Nawata

Kazuhiro Ando

Keiun Ko

Masatsugu Matsunaga

Yasuhiro Shouji

Takeshi Nobukuni

A method of press-working an inorganic substrate, which method uses a vacuum press machine having an air plunger type pressurization system and comprises bringing upper and lower heat plates which have been heated up to a predetermined temperature into contact with a combination set disposed between the upper and lower heat plates after or before the initiation of pressure reduction of a press atmosphere or under a reduced pressure and then carrying out a low pressure loading of from the initiation of pressurization to 0.05 Mpa over 10 seconds or longer and a press machine which is suitable for the above press-working method and which can set and control a low-pressure of 0.02 MPa or lower and comprises an air plunger that works as an air damper when the upper heat plate descends.

Method of press-working inorganic substrate and press machine therefor

Process for the production of composite ceramic printed wiring board

A method of preparing a high-heat-resistance resin composite ceramic that can be used at a high temperature of over 400&deg; C., the high-heat-resistance composite ceramic exhibiting remarkably high heat resistance, excellent in processability, durability against chemicals and durability against plasma, further, exhibiting &ldquo;outgassing&rdquo; to a lesser degree at a high temperature under high vacuum. The method comprises the steps of impregnating an inorganic continuously porous sintered body (I) having an open porosity of at least 0.5% with an organometallic compound (M), heat-treating the impregnated inorganic continuously porous sintered body (I) to decompose the organometallic compound (M) and thereby forming a metal compound which is a carbide, a nitride, an oxide or a composite oxide on an inner wall plane of each of open pores, and filling a heat-resistant silicone resin (R) in the open pores by impregnation under vacuum and thermally curing the heat-resistant silicone resin (R).

Method of the preparation of high-heat-resistance resin composite ceramic

A metal-foil-clad composite ceramic board produced by impregnating a sintered substrate (II) of an inorganic continuously porous sintered body (I) having a true porosity of 12 to 50% and an open porosity of at least 10%, with a thermosetting resin (R) under vacuum, to form a resin-imprgnated sintered substrate (IIR), stacking a metal foil on the resin-impregnated sintered substrate (IIR) and press-forming the resultant laminate, wherein the stacked metal foil has a 10-point average surface roughness Rz of 10 .mu.m or less, and the resin-impregnated sintered substrate (IIR) and the metal foil have substantially no adhesive layer therebetween or have an adhesive layer having a thickness of 10 .mu.m or less therebetween.

Metal-foil-clad composite ceramic board and process for the production

A composite ceramic board having a low dielectric constant and a low heat expansion coefficient and being suitable for use as a heat-resistant material having a high dimensional accuracy and a low dielectric constant, which is formed of a sintered substrate (II) having a thickness of 0.2 to 10 mm and a thermosetting resin (R) which is integrated into the sintered substrate (II) by being impregnated into pores of the sintered substrate (II) under vacuum and cured, the sintered substrate (II) being a substrate obtained from an inorganic continuous porous sintered body (I) produced by sintering a spherical inorganic powder having an average particle diameter of 0.1 to 10 .mu.m in the presence of a sintering aid, the sintered inorganic powder substantially retaining the spherical forms, the inorganic continuously porous sintered body (I) having an average pore diameter of 0.1 to 10 .mu.m, a true porosity of 8 to 35% and a closed porosity of 2% or less.

Composite ceramic board and process for the productivity thereof

A metal-foil-clad composite ceramic board produced by impregnating by impregnating a sintered substrate (II) of an inorganic continuously porous sintered body (I) having a true porosity of 12 to 50% and an open porosity of at least 10%, with a thermosetting resin (R) under vacuum, to form a resin-impregnated sintered substrate (IIR), stacking a metal foil on the resin-impregnated sintered substrate (IIR) and press-forming the resultant laminate, wherein the stacked metal foil has a 10-point average surface roughness Rz of 10 .mu.m or less, and the resin-impregnated sintered substrate (IIR) and the metal foil have substantially no adhesive layer therebetween or have an adhesive layer having a thickness of 10 .mu.m or less therebetween.

An asbestos-free high performance clutch facing which exhibits a less decrease in the friction coefficient as well as a less wearing during long-term repeated cycles of loading at high temperatures is disclosed. The clutch facing is a disk-shaped clutch facing produced by molding a composition for a friction material with heating and under pressure, the composition comprising:

Clutch facing

A process is provided for the production of a base board for printed wiring. The process involves the steps of wrapping a block inorganic continuous porous material with a cloth, impregnating the wrapped block inorganic continuous porous material with a thermosetting resin under reduced pressure, curing the thermosetting resin to form a composite material, and slicing the composite material into base boards having a thickness of 0.2 to 2 mm and a thickness allowance of .+-.5 .mu.m or less, or the steps of impregnating a block inorganic continuous porous material with a thermosetting resin in an impregnation vessel under reduced pressure, taking the block inorganic continuous porous material impregnated from the impregnation vessel, substantially removing the thermosetting resin adhering to surfaces of the block inorganic continuous porous material before the thermosetting resin forms a gel, curing the remaining thermosetting resin under heat to form a composite material, and slicing the composite material into base boards having a thickness of 0.2 to 2 mm and a thickness allowance of .+-.5 .mu.m or less.

Process for the production of base board for printed wiring

A process for producing a copper-clad laminate using a copper foil obtained by subjecting the surface of the copper foil to chemical oxidation thereby to form, on the surface, a fine roughness constituted by a copper oxide of a brown to black color and then reducing the copper oxide constituting the fine roughness in an atmosphere in which a reducing gas is present.

Process for producing copper clad laminate

A friction material for a brake obtained by a process which comprises

Friction material for brake

A base board for a printed circuit board panel which permits easy inspection of a printed circuit by means of a fluorescence-applied circuit pattern inspection machine used for the inspection of printed circuit patterns and which is not altered in the properties as a printed circuit board, the base board having an insulating layer containing 5.0 to 0.00001% by weight of a compound of any one of the formulae (1), (2) and (3), ##STR1##

Base board for printed circuit board

A base board for a printed circuit board having a printed circuit formed from a copper foil on an insulating layer, the insulating layer containing a compound of the formula (1) or a compound of the formula (2). ##STR1##

Printed circuit comprising novel compounds as fluorescence means to

A process for producing a multilayered printed circuit board which comprises using, as an intermediate layer, an inner-layer board obtained by chemically oxidizing the surface of a copper foil constituting an outermost layer of an inner-layer board having a printed circuit formed in the copper foil, thereby to form on the surface a finely roughened layer constituted by a copper oxide of a brown to black color, and then reducing the copper oxide constituting the finely roughened layer in an atmosphere in which a reducing gas is present.

Process for producing multilayered printed board

A process for producing a printed circuit board which can mainly shield electromagnetic waves generated therefrom, a printed circuit board having printed thereon printed devices, a multilayered printed circuit board, or a printed circuit board for mounting chip devices, all of which have high reliability, using a printed circuit board obtained by preparing a semicured resin-based copper-clad laminate by continuous pressing by means of a double-belt pressing method or a batch-wise continuous pressing in which one laminate is produced by press molding between a pair of hot platens, the semicured resin-based copper-clad laminate having a copper foil peel strength of 0.2 kg/cm or more, preferably 0.3 kg/cm or more, and 90% or less of the peel strength thereof as measured after the resin is completely cured, subsequently forming a predetermined printed circuit by etching, and then pressing the resulting semicured resin-based printed circuit board, thereby to exist the conductor surface on almost the same level with the substrate surface.

Process for producing printed circuit board

In a regenerative gas turbine cycle in which heat recovery is carried out by multi-phase and multi-component mixture of compressed air/liquid phase water/steam (hereinafter referred to as MPC mixture), said mixture being obtained by injection of liquid phase water (hereinafter referred to simply as water) into a part of or the whole of compressed gas using air or air based gas (hereinafter referred to as air) as a combustion supporting/working medium gas; the improvement comprising

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Tokyo, Japan

Norio Sayama