Asahi Kasei Chemicals Corporation

Asahi Kasei Kabushiki Kaisha

Norio Sakata

Katsushi Watanabe

Hiroshi Nishino

Masaaki Aramaki

Kazuya Noda

Hiroshi Oyamada

Teruaki Sakuma

Shunichiro I

Tetsuo Kurihara

Yukiyoshi Sasaki

Hiroshi; 2-2-2-204 Kugenuma-Ishigami Nishino

The object is to provide a polyamide resin composition having superior productivity and mechanical strength. A polyamide resin composition includes: (A) Polyamide 66; (B) glass fibers; and (C) a copper compound and a halide. The percentage of a component of the (A) Polyamide 66 having a molecular weight of 30,000 or less as obtained by Gel Permeation Chromatography (GPC) is within a range from 30% by mass to 37% by mass of the total amount of the (A) Polyamide 66, and the percentage of the (A) Polyamide 66 having a molecular weight of 100,000 or greater is within a range from 8% by mass to 15% by mass of the total amount of the (A) Polyamide 66.

Polyamide resin composition, polyamide resin composition pellet group, molded article, and method for producing a polyamide resin composition

The present invention provides a polyamide resin composition comprising a polyamide resin (A), a melamine cyanurate-based flame retardant (B) and a surfactant (C), wherein the polyamide resin composition comprises 100 parts by mass of the total of 60 to 75% by mass of the polyamide resin (A) comprising at least one or more polyamide resin (A1) having a melting point of 255 to 270&#xb0; C. and 25 to 40% by mass of the melamine cyanurate-based flame retardant (B), and 0.1 to 1.0 part by mass of the surfactant (C) comprising at least one or more fatty acid ester of a polyalkylene polyhydric alcohol, and wherein the melamine cyanurate-based flame retardant (B) dispersed in the polyamide resin composition has an average dispersion particle diameter of 1 to 20 &#x3bc;m.

Polyamide resin composition

The present invention can provide a polyamide composition that is more excellent in the heat resistance and tensile elongation of molded products and also more excellent in a balance between these properties than those given by conventional polyamide compositions. The present invention relates to a polyamide composition comprising polyamide, liquid-crystalline polyester, and non-liquid-crystalline polyester, characterized in that Ma part by mass of the polyamide, Mb part by mass of the liquid-crystalline polyester, and Mc part by mass of the non-liquid-crystalline polyester with respect to 100 parts by mass in total of the polyamide, the liquid-crystalline polyester, and the non-liquid-crystalline polyester satisfy the following formulas: 60&#x2266;Ma&#x2266;90, 2&#x2266;Mb&#x2266;38, and 2&#x2266;Mc&#x2266;Ma&#xd7;0.2&#x2212;2.

Polyamide composition

A conductive resin composition produced by melt-kneading a mixture comprising a polyamide (A), a polyphenylene ether (B) (non-terminal-modified polyphenylene ether and/or terminal-modified polyphenylene ether), a rubbery polymer (C), a conductive carbonaceous material (D) (carbon black and/or carbon fibril), and a low molecular weight modifier compound (E) (compatibility agent), wherein the mixture has the following characteristics: (1) the amount of (D) is 0.2 to 3% by weight, based on the total weight of (A) to (E), (2) the amount of (E) is more than 0.01% by weight and less than 0.20% by weight, based on the total weight of (A) to (E), and (3) the amount (a) of a volatile substance contained in (B) satisfies the following formula: 0&#x2266;a&#x2266;&#x2212;7.3&#xd7;E+1.83, wherein E is the % by weight of (E), based on the total weight of (A) to (E), the amount (a) being expressed in terms of a weight decrease (% by weight) of (B) as measured by subjecting (B) to vacuum drying in vacuo at 180 &#xb0; C. for 1 hour.

Conductive resin composition and molded object

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Tokyo, Japan

Norio Sakata