Murata Manufacturing Co., Ltd.

Murata Mfg. Co., Ltd.

Norio Sakai

Yoshihito Otsubo

Mitsuyoshi Nishide

Isao Kato

Shinichiro Banba

Shoichi Kawabata

Akihiko Kamada

Kenji Kubota

Kenji Minowa

Nobuaki Ogawa

Yoshihiko Nishizawa

Kazuhiro Iida

Kazuhiro Isebo

Masato Nomiya

Toshimi Yoshimura

Tetsuro Saito

Tsuyoshi Saitoh

Noboru Kato

Harufumi Mandai

Satoshi Ishino

Osamu Chikagawa

Yoshiaki Kohno

Akira Baba

Atsushi Kumano

Kenji Kawakami

Tetsuya Kanagawa

Shinji Morihiro

Yoshikatsu Nakayama

Jun Sasaki

Keiichi Ichikawa

Issei Yamamoto

Mitsuro Hamuro

Haruhiko Mori

Hiroyoshi Takashima

Bunta Okamoto

Hideo Nakagoshi

Tatsuyuki Yamada

Jun Harada

Keisuke Araki

Isamu Morita

Yuta Morimoto

Junji Kurobe

Muneyoshi Yamamoto

Masaaki Mizushiro

Akihiko Takahashi

Takayuki Tange

Makoto Osamura

Tsuneo Murata

Munetake Miyashita

Shigehiro Nojiri

Hideaki Hashi

Takeshi Wake

Yasuhiro Higashide

Yoshihisa Masuda

Miki Kurabe

Shin-ichi Takakura

Ryoji Nakamura

Hiromichi Wakatsuki

Kuniaki Tamaki

Atsuko Omori

Yoriyuki Matsumoto

Nobuyuki Suzuki

Hiroaki Tsuchida

Keiichi Okada

Masanobu Iwasa

Masahiro Itou

A coil electrodeprovided in a coil componentincludes a plurality of inner metal pinsarranged on an inner peripheral side of a coil core, a plurality of outer metal pinsarranged on an outer peripheral side of the coil coreto form a plurality of pairs with the inner metal pins, a plurality of lower wiring patternsthat connect lower ends of the inner metal pinsand the outer metal pinsin the pairs, and a plurality of upper wiring patternsthat connect upper ends of the outer metal pinsto upper ends of inner metal pinsadjacent to the inner metal pinsthat form the pairs with the outer metal pins

Coil component

An inductor component includes an inductor electrode having two metal pins that form input and output terminals and a connecting conductor that connects one end of each of the metal pins to each other, the inductor electrode arranged such that other ends of the metal pins oppose each other, and a resin layer containing the inductor electrode such that other ends of the metal pins are exposed. The resin layer is formed having a single-layer structure. Variation in the characteristics of the inductor electrode can be reduced as compared to a case where the parts corresponding to the metal pins of the inductor electrode are formed as via conductors or through-hole conductors. Because the resin layer has a single-layer structure, stress acting on joint portions between the metal pins and the connecting conductor can be reduced, which makes it possible to improve the reliability of the inductor component.

Inductor component manufacturing method and inductor component

A first resin layer (resin insulating layer) is formed by forming first and third covering portions in close contact with peripheral surfaces of respective end portions of first and second metal pins on the side closer to first end surfaces thereof, and by forming a body portion in a state of covering the respective surfaces of the first and third covering portions. Therefore, even when the first resin layer is thermally contracted, boundary regions of the one principal surface of the first resin layer around the respective end portions of the first and second metal pins on the side closer to the first end surfaces are filled with the first and third covering portions. Hence gaps can be prevented from being generated in those boundary regions, and a columnar conductor (first metal pin) can be avoided from deviating in position.

Inductor component

A coil component includes an insulating layer in which a magnetic core is embedded, coil electrodes wound around the magnetic core, external connection pad electrodes that are provided on the upper surface of the insulating layer and are connected to the coil electrodes. Each of the coil electrodes includes a plurality of inner metal pins standing in the insulating layer, a plurality of outer metal pins standing in the insulating layer, a plurality of upper wiring patterns formed on the upper surface of the insulating layer, and a plurality of lower wiring pattern formed on the undersurface of the insulating layer. Each of the pad electrodes is directly connected to the upper end surface of the inner metal pin or the outer metal pin, and has, in plan view, an area larger than that of the single upper wiring pattern or the single lower wiring pattern.

Substrate-side wiring electrode patterns, which form a part of a coil electrode, are provided on a wiring substrate, and as a result reductions in the size and profile of a resin insulating layer, in which a coil coreis buried, can be achieved. Therefore, reductions in the size and the profile of a coil modulecan be achieved compared with a coil module of the related art which is formed by mounting a coil component on a wiring substrate. In addition, since the substrate-side wiring electrode patterns, which form a part of the coil electrode, are provided on the wiring substrate, the heat generated by a coilcan be efficiently released from the substrate-side wiring electrode patternsto the wiring substrate. Therefore, the heat dissipation property of the coil modulecan be improved at low cost.

Coil module

A high-frequency component includes a resin layer and a high-frequency circuit provided in and on the resin layer and includes an inductor and an electronic component. The electronic component is arranged on an upper surface of the resin layer. The inductor includes first and second metal pins provided such that upper end surfaces thereof are exposed from the upper surface of the resin layer and lower end surfaces thereof are exposed from a lower surface of the resin layer. The electronic component has a first outer electrode provided at a position superposed with the upper end surface of the first metal pin in plan view and is connected to the first metal pin, and a second outer electrode provided at a position superposed with the upper end surface of the second metal pin in plan view and is connected to the second metal pin.

High-frequency component

A coil componentincludes an insulation layerin which a magnetic body coreis embedded; a coil electrodewound around the magnetic body core; and an input metal pinand an output metal pinfor external connection whose lower end surfaces are respectively provided being exposed from the insulation layerin a state of the input and output metal pinsandbeing provided upright in a thickness direction of the insulation layer. The coil electrodeincludes a plurality of coil metal pinsandthat are arranged around the magnetic body corein a state of being provided upright in the thickness direction of the insulation layer, and the input metal pinand the output metal pinare formed to be larger in diameter than the coil metal pinsand

An inductor component including an inductor electrode includes an insulating layer and an outer electrode for external connection formed on the upper surface of the insulating layer. The inductor electrode includes a metal pin for input/output that has an upper end surface connected to the outer electrode and that is embedded in the insulating layer. The outer electrode includes a base electrode formed on the upper surface of the insulating layer and composed of a conductive paste, and a surface electrode formed on the base electrode by plating. The surface electrode is formed such that the area of a cross section thereof perpendicular to the thickness direction on an outer layer side away from the base electrode is larger than the area of a cross section thereof perpendicular to the thickness direction on an inner layer side close to the base electrode.

An inductor device () includes a magnetic body () and a conductor buried in the magnetic body (), and the conductor includes first conductors () as metal pins. The magnetic body () is formed into a flat plate shape with a first main surface and a second main surface each having a predetermined shape, which oppose each other, and side surfaces connecting the first main surface and the second main surface. The conductor includes the first conductors () one end portions of which are exposed to the second main surface of the magnetic body () and a second conductor () which is connected to the other end portions of the first conductors ().

Inductor device, inductor array, and multilayered substrate, and method for manufacturing inductor device

A technique capable of reducing the resistance of an inductor electrode is provided. A second conductoris constituted by an undercoating layerformed of a conductive paste, and a plating layerformed to cover the undercoating layer. Therefore, the second conductorconstituting part of the inductor electrodecan be formed at a lower cost. Respective first end surfacesandof first and second metal pinsandare connected to each other by the plating layerof the second conductorwithout interposition of the undercoating layerthereof between them. Hence the resistance of the inductor electrodecan be reduced at a lower cost.

Inductor component and manufacturing method for inductor component

An inductor componentincludes a resin layerand an inductor electrode. The inductor electrodeincludes metal pinstothat extend in the resin layerwith upper end surfaces thereof exposed from the upper surfaceof the resin layer, and upper wiring platesandthat are disposed on the upper surfaceof the resin layerand that connect upper end surfaces of the short metal pinsandand upper end surfaces of the long metal pinsandto each other. In this case, the inductor electrodeis formed of the metal pinstoand wiring platestothat each have a specific electrical resistance lower than that of a conductive paste and plating, and the resistance of the entire inductor electrodecan be decreased.

Inductor component and method for manufacturing the same

The present disclosure improves the adhesive strength of a shield film in a high-frequency module that includes a shield film that shields components from unwanted electromagnetic waves from the outside. A high-frequency module is provided with: a sealing body that includes a multilayer wiring substrate, components that are mounted on an upper surface of the multilayer wiring substrate, and a sealing resin layer that is stacked on the upper surface of the multilayer wiring substrate and covers the components; and a shield film that covers a surface of the sealing resin layer. A side surface of the sealing body has curved surface portions formed so as to have a curved surface shape, and the curved surface portions are roughened with a plurality of grooves.

High-frequency module and manufacturing method therefor

An improvement in coil characteristics is achieved by performing accurate positioning of a magnetic core. A coil componentincludes a wiring substrate, a magnetic corethat has a ring-like shape and that is disposed on a bottom surface of the wiring board, and a coil electrodethat is wound around the magnetic core, and the coil electrodeincludes a plurality of inner metallic pinsand outer metallic pinsthat are vertically arranged around the magnetic core. First end portions of the plurality of inner and outer metallic pinsandare each connected, with solder, to an end surface of a corresponding one of a plurality of via conductors, the end surface being exposed at the bottom surface of the wiring board

Coil component and module including the same

A module includes: an insulating layer; an annular coil core in the insulating layer; a coil electrode having outer metal pins arranged along an outer circumferential surface of the coil core, inner metal pins arranged along an inner circumferential surface of the coil core to form pairs with corresponding outer metal pins, bonding wires, each connecting one end surface of each outer metal pin and inner metal pin that form a pair, and wiring electrode patterns, each connecting another end surface of each outer metal pin to another end surface of an inner metal pin adjacent in a predetermined direction to the inner metal pin that forms a pair with the outer metal pin; and a buffer layer, formed from a non-conductive material having a lower elastic modulus than the insulating layer, that covers the surface of the coil core.

Module

An inductor componentincludes a resin layerand an inductor electrode. The inductor electrodeincludes metal pinstothat extend in the resin layerwith end facestoof the metal pinstoexposed from an upper surfaceof the resin layer, and upper wiring platesandthat are disposed on the upper surfaceof the resin layerand that connect the end facesandof the short metal pinsandand the end facesandof the long metal pinsandto each other. In this case, the inductor electrodeis formed of the metal pinstoand the wiring platestothat each have a specific electrical resistance lower than that of a conductive paste and plating.

Inductor component and method of manufacturing inductor component

Growing community of inventors

Moriyama, Japan

Norio Sakai