Samsung Electronics Co., Ltd.

Mitsubishi Electric Corporation

Matsushita Electric Industrial Co., Ltd.

Nec Corporation

Nec Electronics Corporation

S-printing Solution Co., Ltd.

Renesas Electronics Corporation

Mitsubishi Denki Kabushiki Kaisha

Panasonic Corporation

Sumitomo Electric Industries, Limited

Norio Okada

Masato Suzuki

Mitsuhiro Shigeri

Hirohisa Miyazaki

Atsuhiko Yoneda

Minchul Kim

Jong-Kyu Kim

Kyong-Hwan Kim

Yusuru Masuda

Seungwook Jeong

Hakyung Kim

Tatsuki Otani

Jong-Seong Lee

Takahiro Iijima

Hongkue Lee

Mihoko Hotta

Akio Shirasaki

Yoshito Ishikawa

Satoru Taniyama

Tatsuya Usami

Hidemitsu Aoki

Yoshihisa Matsubara

Koichi Ohto

Hiroaki Tomimori

Tatsuo Hatta

Sugiko Honda

Jong Seong Lee

Takamasa Tanikuni

Takeshi Saito

Yoshiyuki Yamamoto

Hideki Hayashi

Shintaro Yamamichi

Tomohiro Nishiyama

Daisuke Oshida

Takehiro Ueda

Eunhye Kim

Keiichiro Tanabe

Hirokazu Honda

Masaharu Nakaji

Keiichi Minamide

Junichi Arita

Masaki Watanabe

Manabu Iguchi

Atsushi Sugitatsu

Hiroyuki Kunishima

Michitaka Kimura

Masahiro Komuro

Nobuo Ohata

Takahiro Onodera

Masashi Nishimoto

Yoshiaki Kumazawa

Donghun Heo

Mikiro Ichijima

Yuzuru Masuda

Yoshitaka Isogai

Shinichi Kaneko

Tsuneo Urisu

Hiroyasu Minda

Hiromitsu Itamoto

Jonghyuk Cho

Yudai Imai

Jun Ueno

Hirokazu Aizawa

Taekung Park

Yoon-Young Cho

Yutaka Tsutsui

Shuji Asaka

The optical module which is disclosed in the present application comprises a plate-like metal stem in which a metallic lead pin is inserted in a through-hole so as to be coaxial with the through-hole and one sheet of a dielectric substrate which is equipped with a high-frequency signal line to be connected to the lead pin and a semiconductor optical integrated element, in which a semiconductor laser and an optical modulator are integrated, and which is connected to the high-frequency signal line with a bonding wire, wherein one side surface of the dielectric substrate extends in a direction perpendicular to the light axis direction of the semiconductor optical integrated element, and the side surface of the dielectric substrate is arranged in contact with a surface of the metal stem.

Optical module

An optical module includes: a stem including a first surface and a second surface opposite to the first surface; a thermoelectric cooler including a heat-releasing substrate fixed to the first surface; a semiconductor laser element attached to the thermoelectric cooler; a cap fixed to the first surface and covering the thermoelectric cooler and the semiconductor laser element; a lens fixed to the cap; and a restriction body fixed to the second surface. The linear thermal expansion coefficients of the heat-releasing substrate and the restriction body are smaller than the linear thermal expansion coefficient of the stem.

Optical module having restriction body fixed to stem and having a linear thermal expansion coefficient smaller than that of the stem

Provided is an optical module comprising a plate-like metal stem and a semiconductor optical modulation element mounted to a dielectric substrate provided on one side of the metal stem, wherein the metal stem has a metal stem penetration section in which a metal lead pin is inserted coaxially in a penetration hole which is formed in the metal stem and a dielectric member is provided to fill the penetration hole around the outer circumference of the lead pin, and a signal for modulation is supplied to the semiconductor optical modulation element connected in parallel with a terminal matching circuit, from the other side of the metal stem via the metal stem penetration section, wherein the terminal matching circuit is configured by a series connecting body which is comprised of a first resistor and a parallel body which is comprised of a second resistor and a capacitor.

Optical module and optical transmitter

Robotic device

A semiconductor laser () emits laser light. An electro-absorption optical modulator () modulates the laser light. The electro-absorption optical modulator () includes a plurality of electro-absorption regions () having different extinction characteristics, whereby the extinction ratio curve of the optical device can be controlled to have a shape with multiple steps that is suited to driving conditions.

Optical device

An electronic device according to various embodiments of the present disclosure may include a communication interface and a processor, wherein the processor may be configured to receive first battery level information of a first earpiece and second battery level information of a second earpiece, via the communication interface, to identify a charging method corresponding to the first battery level and the second battery level, among a plurality of charging methods for charging at least one of the first earpiece or the second earpiece, and to control to supply charging power to at least one of the first earpiece or the second earpiece, via a cable which connects the electronic device with at least one of the first earpiece or the second earpiece, using the charging method.

Method for controlling earpiece and electronic device for supporting the same

An optical module includes: a stem; a temperature control module; a carrier; a light emitting element fixed on a light emitting element fixing surface of the carrier, having a front surface and a rear surface opposite to each other, emitting signal light from a first emission point in the front surface, and emitting back light from a second emission point in the rear surface; a light receiving element fixed on the carrier by a light receiving element fixing surface; a lens cap; and a lens, wherein a reflecting surface is provided on the carrier, the light receiving element receives the back light reflected by the reflecting surface, and a center of a light receiving surface of the light receiving element is positioned between the front surface and the rear surface in an optical axis direction of the signal light.

Multi-function printer

A compact electronic device as a constituent element of a wireless communication system using a sensor. A first feature of the device is that a first semiconductor chip is bare-chip-mounted over a front surface of a first wiring board in the form of a chip and a second semiconductor chip is bare-chip-mounted over a second wiring board in the form of a chip. A second feature is that a wireless communication unit and a data processing unit which configure a module are separately mounted. A third feature is that the first and second wiring boards are stacked in the board thickness direction to make up the module (electronic device).

Electronic device

Laser printer

A first resistor connected in parallel to a semiconductor optical modulator having first ends, the first resistor and first ends connected to a reference potential. A first end of a first transmission line is connected to second ends of the semiconductor optical modulator and the first resistor. A second transmission line is connected in series to the first transmission line and has an impedance lower than that of the first resistor. A first end of the second transmission line is connected to a second end of the first transmission line. A third transmission line is connected in series to the first and second transmission lines and has an end connected to a second end of the second transmission line, and has an impedance equal to that of the first transmission line. A second resistor and a capacitor are connected in series between the third transmission line and the reference potential.

Semiconductor optical modulation device

Growing community of inventors

Tokyo, Japan

Norio Okada