Sanyo Electric Co., Ltd.

Tokyo Sanyo Electric Co.

Norio Miura

Hisao Uehara

Masahiro Okuyama

Makoto Shimizu

Atsuyoshi Tanioka

Kazuhiko Moriwaki

A single liquid-crystal display can be used to be either of direct-vision or projection type, if required. Separate display devices for monitor and OHP are not required. Further, power consumption can be reduced, with the service life of the display being prolonged to improve economy. The liquid-crystal display includes a display housing which receives a liquid-crystal panel, a driver circuit unit and a cooling fan, the display housing being detachably mountable in a back light stand. When the display housing is mounted or dismounted in the back light stand, the fan and back light can automatically be turned on or off to reduce the power consumption. The liquid-crystal panel can be prevented from being degraded by cooling it by way of the fan.

Direct-vision/projection type liquid-crystal display

In a display housing, first and Second liquid-crystal panels are disposed in parallel with each other, and a fluorescent lamp is positioned beside both ends of a gap between these panels. Thus, when used for a transmission type display, e.g. an OHP, the first liquid-crystal panel for light shutter is set in a transmission condition to transmit light from a light source for the OHP or the like and to irradiate the second liquid-crystal panel for displaying an image, thereby projecting the image in a magnified size onto a screen or the like. When used for a direct-vision type display, e.g. a monitor for a personal computer or the like, the first liquid-crystal panel is set in a shading condition to effect diffuse reflection of light from the fluorescent lamp by the first liquid-crystal panel and to irradiate the second liquid-crystal panel, thereby providing a direct-vision image.

Direct-vision/projection type liquid-crystal display having light source

A hybrid integrated circuit device comprises a metal substrate, a casing member and external leads. An insulating film is formed on the metal substrate, conductive paths are formed on the insulating film, circuit elements are connected to the conductive paths, and conductive pads are formed in the tip portions of the conductive paths. The casing member comprises a sealing portion surrounding the circuit elements and a connector portion projected from the bottom portion of the sealing portion and extending beyond an end of the metal substrate, and formed of insulating resin. Each of the external leads has one end connected to each of the conductive pads and supported by the side surface of the connector portion.

Hybrid integrated circuit device capable of being inserted into socket

An inductance element comprises conductive paths of copper and a spool member arranged on a substrate, and insulated winding formed by a fine copper wire whose surface is coated with an insulating film of urethane etc. is wound around the spool member so that both end portions thereof are subjected to ultrasonic vibration by an ultrasonic bonding apparatus to be connected to the conductive paths by ultrasonic bonding. Thus, the end portions of the winding can be processed by local heating with application of ultrasonic vibration, whereby the coil needs not be entirely heated and an inductance element can be readily implemented directly on the substrate.

Method of manufacturing an inductance element

A composite film comprises two copper films (11, 12) adhered to and insulated from each other by a thermal setting resin (13) to be shaped in a belt shape. A lead frame is formed by etching one copper film of the composite film such that a plurality of lead patterns (15) are in succession defined including a plurality of leads (16) arranged approximately equispaced to extend in the length direction and the other copper film of the composite film is etched to form supporting patterns (19) corresponding to the respective lead patterns and for supporting the corresponding ones. A semiconductor element (20) is provided in association with the respective lead patterns and the semiconductor element is connected to the respective leads of the corresponding lead patterns by wire bonding, while the respective leads are connected to external terminals (22). The semiconductor element, the lead patterns and a portion of the external terminals are molded with a resin material so that a mold layer (23) is formed and then the composite film is severed for each of the mold layers, whereby a semiconductor device is provided.

Composite film, semiconductor device employing the same and method of

A hybrid integrated circuit unit comprising an integrated circuit assembly having at least one semiconductor device and a plurality of conductors extending to the first connecting terminals, a printed circuit board having at least one discrete element and a plurality of conductors beginning from the second connecting terminals and connecting means for connecting the first and the second connecting terminals, the integrated circuit assembly and the printed circuit board are unified by said connecting means.

Growing community of inventors

Oota, Japan

Norio Miura