Nec Corporation

Nec Network and Sensor Systems, Ltd.

Norio Masuda

Naoya Tamaki

Masafumi Nakada

Mizuki Iwanami

Takashi Harada

Masahiro Yamaguchi

Masahiro Murakami

Keishi Oohashi

Noboru Fujihara

Ken-ichi Hatakeyama

Masayuki Inomata

Takashi Nakano

Keishi Ohashi

Kenichi Arai

Masamoto Tago

Hirokazu Tohya

Noriaki Ando

Toshihide Kuriyama

Toru Aoyagi

Makoto Moribe

Ken-ichi Arai

Toshiki Shimasaki

Jun-Ichi Yorozu

To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, a first electronic component housing chamberhouses the high voltage power supply module(the first electronic component). A second electronic component housing chamberhouses the TWT(the second electronic component). At least some of a first partition plateand a second partition plateare provided so as to face each other. A first gap part Gis provided between the first partition plateand the second partition plate

Electronic component housing apparatus and electronic device

Provided are a slow wave circuit and a traveling wave tube suitable for an increase in fineness with regard to processing beam holes, and suitable for higher frequencies. A slow wave circuit () includes a meandering waveguide () and a beam hole () that pierces the meandering waveguide (), and the cross-section of the beam hole () in the direction orthogonal to the long direction is in the shape of a polygon having a larger number of sides than a quadrilateral.

Slow wave circuit and traveling wave tube

There is provided a shield-structured loop element which can suppress noise via a silicon substrate and can be manufactured by a semiconductor process. The loop element includes: a first well of a first polarity that is formed on a substrate; a deep well of a second polarity that is formed below the first well; a ring-shaped second well of a second polarity that is formed on the deep well along an outer periphery of the deep well; a third well of the first polarity that is formed in an island area surrounded by the deep well and the second well; a looped conductor that is formed in a layer above the third well and has smaller outer dimensions than those of the third well; and a first path that connects the second well to a bias power supply. The second well and the deep well are electrically connected to each other.

Loop element and noise analyzer

A magnetic field sensor fabrication method of directly forming, with an aerosol deposition method, at a tip of an optical fiber, a magnetooptical layer having a refractive index that changes depending on a magnetic field, the method includes establishing a relationship of dc&#x2266;d&#x2266;dr among a diameter d of the magnetooptical layer, a diameter dc of a core of the optical fiber, and a diameter dr of a clad thereof.

Electric field/magnetic field sensors and methods of fabricating the same

An electromagnetic field distribution measurement apparatus () according to the present invention includes: an electromagnetic field probe () for measuring an electromagnetic field distribution; a scan apparatus () for scanning the vicinity of a wiring () with the electromagnetic field probe (); and a data processing apparatus () for calculating the offset value (&#x394;Xd) of the coordinate of the electromagnetic field probe () from the coordinate of the wiring (). The data processing apparatus () extracts a characteristic point (Eto E) of the measured electromagnetic field distribution and calculates the offset value (&#x394;Xd) based on the coordinates of the extracted characteristic point (Eto E).

Electromagnetic field distribution measurement apparatus

An electric field sensor or a magnetic field sensor includes an optical fiber and an electro-optic layer or a magneto-optic layer. The electro-optic layer or a magneto-optic layer is provided on an end surface of an end portion of the optical fiber. The end surface of the optical fiber is a convex shape. The optical fiber may have the end portion with a shape of a substantial cone formed by extending the end portion, and the electro-optic layer or the magneto-optic layer may be formed on a side surface of a front end of the substantial cone. A dielectric layer may be further included between the optic layer and the end surface.

Electric field sensor, magnetic field sensor, electromagnetic field sensor and electromagnetic field measuring system using these sensors

An electric field sensor is obtained by directly forming an electrooptical film of Fabry-Perot resonator structure on a polished surface at a tip of an optical fiber by an aerosol deposition method.

Electric field sensor and method for fabricating the same

Two coil forming elements () formed of conductor layers and a contact means (), which is formed in an interlayer dielectric film () interposed between the conductor layers and brings the upper and lower coil forming elements into contact with each other through a via hole form a stacked coil (). One end of the stacked coil is connected to an upper grounding layer () of a strip line (), and the other end of the stacked coil is connected to a strip conductor () of the strip line. The number of turns of the stacked coil is larger than 1. A magnetic flux penetrating through the stacked coil increases to be able to induce a relatively large electromotive force. Thus, a high spatial resolution can be obtained easily.

Magnetic field sensor

An electronic apparatus comprises a function module having a multilayer wiring unit including a first signal wiring corresponding to an internal layer wiring, a first signal via, a first reference potential wiring, a first signal pad to which the first signal wiring is connected through the first signal via, a first reference potential pad that surrounds the periphery of the first signal pad and to which the first reference potential wiring is connected, and a first reference potential connected to the first reference potential pad; a inultilayer circuit board; a first conductor; and a second conductor.

Electronic apparatus

An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Radio frequency circuit module on multi-layer substrate

The present invention provides a device for detecting a magnetic field comprising: a dielectric body; an electrically conductive pattern; and an electrically conductive ground region. The electrically conductive pattern so extends in the dielectric body as to form a dielectric looped face at least partially surrounded by the electrically conductive pattern, and the electrically conductive pattern having a first end electrically connected to an external electrically conductive line and a second end. The electrically conductive ground region is formed in the dielectric body. The electrically conductive ground region is electrically connected to the second end of the electrically conductive pattern and is electrically isolated from other parts of the electrically conductive pattern than the second end, so that the electrically conductive ground region serves as a ground to the electrically conductive pattern.

Magnetic field detector having a dielectric looped face

A semiconductor device evaluation apparatus for correctly measuring emission noise of a semiconductor device includes: an electromagnetic field measurement unit for measuring a two-dimensional electromagnetic field distribution in a plane parallel to an upper surface of a semiconductor device; a distribution image generation unit for not only extracting a distribution of an electromagnetic field higher than a threshold value determined in advance from the electromagnetic field distribution of the semiconductor device measured by the electromagnetic field measurement unit but converting the extracted electromagnetic field distribution to a distribution image in a two-dimensional plane; an image collation unit for collating the distribution image generated by the distribution image generation unit with a projected image, generated in advance, of an interconnect and a lead frame of the semiconductor device; and an emission source specifying unit for specifying an interconnect or a lead frame whose images are superposed, if the images of the electromagnetic field distribution, and the interconnects and lead frames are superposed on each other in collation by the image collation unit, as an emission source.

Growing community of inventors

Tokyo, Japan

Norio Masuda