Sony Corporation

Norio Kawatani

Atsushi Nakamura

Hiroshi Tokunaga

Yukio Yamada

Kazuaki Suzuki

Iwao Ichikawa

Kazumasa Osoniwa

Masahisa Hosoi

Hirokazu Nakayama

A first electronic component having two alignment holes perforated at predetermined positions thereof so as to be spaced away from each other by a predetermined interval is held with a receiving table, and also a second electronic component having two alignment marks formed at predetermined positions thereon so as to have an interval therebetween in agreement with that between the two alignment holes is held with a position-adjusting mechanism. In a state in which the alignment marks of the second electronic component are introduced in the corresponding alignment holes of the first electronic component, the mark-recognition apparatus captures the alignment marks and the alignment holes in the same fields of view thereof and measures the positions of the two components, and the position-adjusting mechanism adjusts the position of the second electronic component such that the alignment marks of the second electronic component lie at predetermined positions in the alignment holes of the first electronic component.

Electronic-component alignment method

A first electronic component having two alignment holes perforated at predetermined positions thereof at a predetermined interval is held with a receiving table, and also a second electronic component having two alignment marks formed at predetermined positions thereon at an interval therebetween in agreement with that between the two alignment holes is held with a position-adjusting mechanism. In a state in which the alignment marks of the second electronic component are introduced in the corresponding alignment holes of the first electronic component, the mark-recognition apparatus captures the alignment marks and the alignment holes in the same fields of view thereof and measures the positions of the two components, and the position-adjusting mechanism adjusts the position of the second electronic component such that the alignment marks of the second electronic component lie at predetermined positions in the alignment holes of the first electronic component.

Electronic-component alignment method and apparatus therefor

This invention provides a thermocompression bonding equipment which, when the material to be bonded is to be changed, allows easy replacement and preparation of a compression bonding head, reduction of working time required for replacement and preparation of a compression bonding head, and simplified adjustment of the compression bonding head. The thermocompression bonding equipment is provided with a head unit 20 comprising a base 10, thermocompression bonding head 56 and sliding mechanism 50 for sliding the thermocompression bonding head 56 provided on the base 10, pressing means 30, which are structured independently from the head unit, for pressing the sliding mechanism 50 to slide the thermocompression bonding head 56, thereby thermocompression bonding the material of ACF, LCD, and TAB, and a base frame 40 provided with positioning means 40, 41 for positioning the base 10.

Thermocompression bonding equipment

A thermocompression-bonding unit and a pressure-bonding head unit which are structurally simple and where reliability is high. The pressure-bonding head unit includes a pressure-bonding head; pressure-bonding head holding means for integrally fixing and holding the pressure-bonding head, the pressure-bonding head holding means being formed with a cutout from a first direction side in parallel with the pressure-bonding surface and also being formed with an opening perpendicular both to the first direction and the pressure-bonding surface; first deformation means for deforming the pressure-bonding head holding means so that a cutout inlet of the cutout opens or closes by a desired amount; and second deformation means for deforming the pressure-bonding head holding means so that one opening end or the other opening end of the opening is crushed in a direction parallel to the first direction by a desired amount. Thus the pressure-bonding unit and the pressure-bonding head unit, which are structurally simple and where reliability is high, can be realized.

Pressure-bonding unit and pressure-bonding head unit

A thermocompression bonding apparatus wherein object parts can be connected with a high degree of accuracy by thermocompression bonding and the entire apparatus is not deformed readily by a high pressure and a member of a large size can be connected at a fine pitch with a high degree of accuracy. The thermocompression bonding apparatus is constructed so as to bond a first member to a second member by thermocompression bonding and comprises a base member, a holding device for holding the second member thereon, a heat generation element for applying heat to the first member, and a pressurization member for pressing the heat generation element against the first member and the second member. The holding device, the heat generation element and the pressurization member are disposed mechanically separately from the base member. Also a thermocompression bonding method and a process of manufacturing a liquid crystal display device which are performed using the thermocompression bonding apparatus are disclosed.

Thermocompression bonding apparatus, thermocompression bonding method

An apparatus for positioning circuit components such as flat package IC's at predetermined positions of a printed circuit board and a method therefor are disclosed. In the apparatus, a guide body is provided on the printed circuit board and a positioning member is installed on a retainer plate which holds one of the circuit components. The guide portion guides the positioning member to a point where the component coincides with the predetermined position.

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Kanagawa, Japan

Norio Kawatani