Denso Corporation

Norio Goko

Toshihisa Taniguchi

Atsushi Sakaida

Atusi Sakaida

Yoshihiko Shiraishi

Masahiro Asano

Keiji Okamoto

Yuji Tuduki

A position detection device, for detecting a change in relative position of a detection object with respect to a reference portion, includes: a base portion immovable with respect to the reference portion; a following portion deformable or movable following relative movement of the detection object with respect to the reference portion; an expandable and contractible member; and a heat flux detection section. The expandable and contractible member is provided between the base portion and the following portion, is made of a material expandable and contractible according to deformation or movement of the following portion, and generates heat during contraction and absorbs heat during expansion. The heat flux detection section is provided to be subjected to heat of the expandable and contractible member, and is configured to detect a heat flux that is a flow of heat between an inside and an outside of the expandable and contractible member.

Position detection device

A workpiece holding method and holding system able to shorten the workpiece attachment/detachment time, wherein pressurized air is circulated through a nozzle of an ejector unit of a chuck at all times to make the inside of a suction chamber a negative pressure before chucking a workpiece, completion of chucking is detected based on a pressure value detected by a pressure sensor after chucking the workpiece, and the workpiece is unchucked by having a valve close an exhaust port to raise the pressure inside an exhaust chamber and introducing pressurized air from the ejector unit to the suction chamber.

Workpiece picking and placing method

A dummy work (DW: a work for printing a reference necessary for subsequent printing) is moved to a printing position while the dummy work is fixed to a work alignment mechanism, and solder printing is made. The printed dummy work is then returned to the work alignment position and its image is taken by image processing camerasand an image of position coordinates of a solder bump specified for alignment is stored. Positioning of subsequent works W is conducted on the basis of the image of the dummy work stored and solder printing of the works is subsequently made at the printing position.

Screen printing method and apparatus thereof

Growing community of inventors

Kariya, Japan

Norio Goko