Kabushiki Kaisha Toshiba

Norio Fujimura

Toshiaki Tanaka

Satoshi Komoto

A semiconductor light-emitting device has a pair of leads placed in parallel, a light-emitting element on the upper end of one lead, a bonding wire for electrically connecting the semiconductor light-emitting element of the upper end of another lead, and an envelope formed from a light-transmitting resin for sealing the semiconductor light-emitting element, the bonding wire, and the upper end of the leads, provided with a non-circular lateral cross-sectional surface structure with a long axis and a short axis. In the device, when observed along a direction in which the plurality of light-emitting devices are mounted on a same lead frame, a curvature of the lateral direction of said envelope is smaller than a curvature of the vertical direction of said envelope.

Semiconductor light-emitting device and method for manufacturing the device

Method of fabricating a light emitting device

A semiconductor light emitting device includes at least two semiconductor light emitting elements which emit different colors of light to each other. The device further includes a lead frame for supporting the light emitting elements and a resin molding for sealing these elements. The external form of this resin molding is an ellipsoid or a part of an ellipsoid in which the curvature in the perpendicular direction to the element row is designed to be smaller than that in the parallel direction to the row. As a result, the device has a widely spread mixed color range especially in the perpendicular direction to the element row and high luminous intensity especially in the parallel direction to the element row. So, a multicolor light emitting device having a high ability of color mixture as well as high luminous intensity can be obtained.

Growing community of inventors

Kitakyushyu, Japan

Norio Fujimura