Sharp Kabushiki Kaisha Corporation

Norimitsu Nie

Hirokazu Yoshida

Motoji Shiota

Yasunori Chikawa

Atsushi Ono

Akio Inohara

Satoru Tone

Makoto Kanda

A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.

Liquid crystal display device and/or circuit substrate including bump electrodes and electrode pads

Semiconductor device with bumps on electrode pads oriented in given direction

Semiconductor device including bump electrodes

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Kashiba, Japan

Norimitsu Nie