Toray Industries, Inc.

Norimitsu Natsume

Nobuyuki Arai

Hiroshi Takezaki

Kenichi Yoshioka

Junko Kawasaki

Alfred P Haro

Jonathan C Hughes

An epoxy resin composition having components (A), (B), (C), and (D), wherein the epoxy resin composition has a viscosity at 40&#xb0; C. of about 1&#xd7;10to about 1&#xd7;10Pa&#xb7;s, a curing start temperature of about 90 to about 110&#xb0; C., and a minimum viscosity at the curing start temperature of about 2 to about 20 Pa&#xb7;s, wherein the components (A), (B), (C), and (D) are as follows: (A) About 60 weight parts or more of a tetraglycidyl amine type epoxy resin per 100 weight parts of the epoxy resin blend; (B) Dicyandiamide; (C) Diaminodiphenyl sulfone and (D) Urea compound.

Epoxy resin composition for fiber reinforced composite material, prepreg, and fiber reinforced composite material

A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2).

Prepreg and carbon fiber reinforced composite materials

A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

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Ehime, Japan

Norimitsu Natsume