Mitsui Toatsu Chemicals, Incorporated

Norimasa Yamaya

Akihiro Yamaguchi

Masahiro Ohta

Keizaburo Yamaguchi

Yoshimitsu Tanabe

Tatsuhiro Urakami

Shoji Tamai

Nobuhito Koga

Midori Yamazaki

Kenichi Baba

Tatshuiro Urakami

Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

Resin forming compositions

Bismaleimide compounds

Aromatic diamine compounds, bismalemide compounds, thermosetting resin

Aromatic diamine compounds, bismaleimide compounds, thermosetting resin

Disclosed herein is an aromatic amine resin formed of a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A means a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 denotes a halogen atom or a hydroxyl, C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l stands for 1 or 2, m is an integer of 0-3, when m is 2 or 3, R.sup.1 s may be the same or different and two of R.sup.1 s may join together into a 5- to 6-membered alicyclic moiety which may optionally contain one or more side chains, and n stands for an integer of 0-300.

Production process for making aromatic amine resins

A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a fibrous reinforcing material. The composition has excellent impact resistance and toughness while retaining conventional high heat resistance.

Thermosetting resin composition

The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be same or different and may join to form a 5- or 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.

Aromatic amine resins, processes for producing the same and a

Disclosed is a composition for forming a thermosetting resin having excellent impact resistance and toughness. The composition comprises a bismaleimide compound represented by formula (I): ##STR1## wherein R is a hydrogen atom or methyl, and an amine compound represented by formula (II): ##STR2## wherein X is a radical selected from the group of divalent hydrocarbons having from 1 to 10 carbon atoms, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl, oxo, ##STR3## or by formula (III)): ##STR4## where in n is an integer of 0 to 50. Also disclosed is a process for preparing the composition.

Thermosetting resin from penta arylene bis maleimide

Disclosed is a thermosetting resin composition which comprises a specific bismaleimide compound or polymaleimide and a specific aromatic diamine compound. It can be widely used for electrical and electronic parts, various structural parts, sliding parts and the like.

Thermosetting resin composition from pentaphenylene diamine

A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commerical utility in electric and electronic components such as sealing materials, sockets and connectors and other applications.

The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be the same or different and may join to form a 5- or 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.

Thermosetting resin composition comprising an aromatic amine

A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a solid lubricant. The composition has low coefficient of friction and excellent wear resistance, and can be utilized for self-lubricating parts.

A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commercial utility in electric and electronic components such as sealing materials, sockets and connectors and other applications.

The present invention relates to a thermosetting resin composition comprising about 100 parts by weight of a polyimide and from 5 to about 100 parts by weight of a bismaleimide having a similar structure and processes for preparing the same.

Thermosetting resin compositions

This invention provides thermosetting-resin-forming compositions which are formed of (a) a bismaleimide compound represented by the following formula: ##STR1## wherein R represents a divalent group of ##STR2## X being a direct bond or a group selected from the group consisting of divalent hydrocarbon groups having 1-10 carbon atoms, hexa-fluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxo, and (b) a specific diallylbisphenol compound. These compositions can provide thermosetting resins having high cracking resistance due to improved impact resistance and toughness and low water absorption.

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Yokohama, Japan

Norimasa Yamaya