Fuji Xerox Co., Ltd.

Norikuni Funatsu

Masaki Kataoka

Michiaki Murata

Kenji Yamazaki

Yoshihisa Ueda

Kazuyuki Oda

Takayuki Takeuchi

Koichi Saitoh

Ichiro Tomikawa

Toshinobu Hamazaki

Tomoki Umezawa

Kumiko Tanaka

Kohzo Hara

Koji Ikegami

Kunihito Satou

Toshimichi Iwamori

An ink jet recording head and a process for producing the same, and an ink jet recording apparatus are provided that improve the printing performance and also improve the production efficiency. A conjugated bodyformed by conjugating silicon wafersandis cut, whereby nozzlesare opened, and cutting into head chip units is carried out. At this time, deep groovesare formed on the surface of the silicon waferby anisotropic etching, and they are penetrated by etching on the opposite side. Groovesare formed on the silicon waferby using the thus penetrated deep groovesas a mask.

Process for producing ink jet recording head

The present invention provides an inkjet recording head cartridge and an inkjet recording apparatus that have a simple structure and high reliability. Since individual flow passages in which ink emission orifices are formed are communicated directly with a rectangular ink supply chamber, it is prevented that a bubble of such a size as to cause printing defects rises through an ink supply chamber and blocks the individual flow passages. Also, since ink heated within the ink supply chamber is moved upward to the ink tank chamber by convection and grows an air lump sealed beforehand, it is prevented that a bubble will grow in the ink supply chamber. Furthermore, by allocating a large cross-sectional area to the ink supply chamber, it is prevented that meniscus oscillation of the ink emission orifices is amplified by pressure oscillation caused by ink emission and causes a printing defect. Therefore, reliable printing can be performed with a simple construction.

Inkjet recording head cartridge and inkjet recording apparatus

A satisfactory bonding is implemented at low cost. In a step, a resin layer is formed on a bonding surface side of a silicon wafer on which portion are formed electro-thermal transducers. In a later step, the silicon wafer and another silicon wafer are aligned and fixed temporarily, then the atmosphere is set at a pressure of 10 mbar or lower and the temperature is set at 300&deg; C. or higher, and voltage is applied across the both wafers while pressure is applied to the wafers. When the value of an electric current flowing across the wafers has reached a level of a certain current value or lower, the application of the voltage is stopped and the atmosphere is opened to the atmospheric pressure while reducing the temperature.

Substrate bonding method, bonded product, ink jet head, and image forming apparatus

The present invention provides a liquid jet printing head, a method of manufacturing the same, and a liquid jet printing apparatus, which allow stable, high speed, and continuous printing. A liquid jet printing head provides an inflow of liquid from an inlet to a common chamber, then along with the surface of heating elements of a heating element substrate and with a wall of a housing to separate channels. Liquid drops will be ejected by heating the heating elements. Since liquid may flow linearly from the inlet to the separate channels in accordance with the present invention, smooth flow promotes evacuation of bubbles through a nozzle, while cooling the heating element substrate with liquid flowing along with the substrate. The present invention provides thereby stable printing with high speed, continuous ejection (printing) of liquid drops.

Liquid jet printing head and method for manufacturing the same

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Ebina, Japan

Norikuni Funatsu