Sharp Kabushiki Kaisha Corporation

Other

Noriki Iwasaki

Tadayuki Into

Satoru Fukunaga

Akio Shimoyama

Kouki Kitaoka

Hiroshi Yasumura

Masahiko Monzen

Yasuhiro Goto

Tatsuyuki Ishioka

In a method of thinning a semiconductor wafer, a protection tape smaller in size than the semiconductor wafer is applied to a front of the semiconductor wafer, and a back of the semiconductor wafer is etched. In the etching process, a chemical liquid falls down from the semiconductor wafer without being accumulated on the protection tape because the protection tape is smaller in size than the semiconductor wafer.

Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers

A semiconductor chip pickup apparatus of the present invention includes an aspiration section and an aspiration unit connected to the aspiration section, in which the aspiration unit includes a stage for mounting the semiconductor chip thereon and an adhesive sheet is attached to the semiconductor chip between the stage and the semiconductor chip, the stage includes undulations in at least a part of an area in which the semiconductor chip is mounted, and by operating the aspiration section, a suction force is applied to at least a part of an area in which the undulations are formed.

Pickup apparatus for semiconductor chips

A die bonding apparatus includes a device for making a coarse surface in a region where an identifier is to be applied to a lead frame; an application device for applying the identifier to the coarse surface region, a dividing device for dividing a wafer into chips, a test device for testing the wafer which has not been divided into chips yet in positions corresponding to the prospective chips, a storage device for storing information about positions of the chips on the wafer and the test results, a die bonding device picking out the chips from the wafer for die-bonding them to the lead frame having the identifier, a reading device for reading the identifier of the lead frame to which the chips are to be die-bonded, an information processing device for adding information which the identifier contains to the test results and position information about each of the chips to make test information, and an output device for outputting the test information.

Die bonding apparatus

An apparatus for sealing a semiconductor package, which is used for performing a sealing operation, includes a unit for emitting ultraviolet rays, and a package base having an entrance surface and an exit surface. The package base between the entrance surface and the exit surface is made of quartz glass. The emitting means closely contacts the entrance surface. And ultraviolet rays emitting by the emitting unit are applied through the quartz glass to the semiconductor package which is mounted on the exit surface.

Growing community of inventors

Nara, Japan

Noriki Iwasaki