Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Norihito Tsukahara

Kazuhiro Nishikawa

Daisuke Sakurai

Kazushi Higashi

Hiroyuki Otani

Yoshihiko Yagi

Takahiro Yonezawa

Masayoshi Koyama

Takayuki Hirose

Toshiyuki Kojima

Hidenori Miyakawa

Shozo Ochi

Yoshifumi Kitayama

Takashi Akiguchi

Keiko Ikuta

Taichi Nakamura

Kouji Ikeda

Kazuhiro Ikurumi

Kohichi Tanda

Kenichi Sato

Hirohisa Tanaka

Yutaka Nakamura

Hiroaki Oka

Masato Suzuki

Masahiko Tsukuda

Shigeaki Sakatani

Takeshi Yamamoto

Daido Komyoji

Hidenobu Nishikawa

Kazuhiro Nobori

Tsukasa Shiraishi

Kazuto Nishida

Mitsunori Yokomakura

Kei Toyota

Tomohiro Ota

Masato Hirano

Mitsumasa Oku

Akio Oki

Yutaka Harada

Koichi Kumagai

Masayuki Okano

Susumu Matsuoka

Shinji Murakami

Manabu Gokan

Lianji Jin

A fiber assembly includes a support sheet, a warp yarn group in which warp yarns including a polymer material are arranged, and a weft yarn group in which weft yarns including a polymer material are arranged. A surface of the support sheet has been subjected to a release treatment. The warp yarn group and the weft yarn group are on the surface of the support sheet. The warp yarn group and the weft yarn group define contact portion regions and non-contact portion regions. In each of the contact portion regions, one of the warp yarns is integrated with one of the weft yarns. Each of the warp yarns and the weft yarns has a line width of 1 μm to 10 μm, inclusive. One of the contact portion regions has a fiber density which is higher than a fiber density of one of the non-contact portion regions.

Fiber assembly and method for producing fiber assembly

A device for manufacturing a fiber assembly includes: a rotating body that has a cylindrical shape, and winds and holds a plurality of support sheets around an outer peripheral surface around a rotation axis of the rotating body; a plurality of supply nozzles arranged along a direction parallel to the rotation axis, the supply nozzles supplying a polymer material to be a material of fibers to the plurality of support sheets; a supply nozzle moving unit that relatively moves the plurality of supply nozzles in the direction parallel to the rotation axis of the rotating body, in which the rotating body is rotatable about the rotation axis to wind, on main surfaces of the plurality of support sheets, fibers obtained by naturally cooling or naturally drying the polymer material supplied from the plurality of supply nozzles, and the rotating body includes a plurality of guide members in an annular shape circumscribing the outer peripheral surface of the rotating body concentrically to regulate positions of the plurality of support sheets.

Device and method for manufacturing fiber assembly

An ion-sensitive substance containing a crown ether structure composed of a repeating unit represented by formula (a): &#x2014;CRR&#x2014;CRX&#x2014;O&#x2014; . . . (a) (in the formula, X is an organic group having an alkoxysilyl group at a terminal, and R, Rand Rare each a hydrogen atom or a hydrocarbon group), and a part or all of the alkoxysilyl groups in the crown ether structure may be hydrolyzed to form a silanol group.

Ion-sensitive substance, ion-sensitive membrane using the same, and method for producing the ion-sensitive substance

The present invention provides a field asymmetric ion mobility spectrometer for selectively separating at least one kind of material from a mixture containing two or more kinds of materials. A filter included in the spectrometry comprises first&#x2014;four plate-like electrodes each having a principal plane parallel to a direction from an ionizer toward a filter. The second plate-like electrode is located between the first plate-like electrode and the third plate-like electrode. The third plate-like electrode is located between the second plate-like electrode and the fourth plate-like electrode. The third and fourth plate-like electrodes are electrically connected to the first and second plate-like electrodes, respectively. An interspace is formed between two adjacent plate-like electrodes. The present invention provides a field asymmetric ion mobility spectrometer having high separation ability.

Field asymmetric ion mobility spectrometer and method for separating mixture using the same

A pin () is moved down in a nozzle (), the end of paste () protruded from the discharge opening () of the nozzle () to a target object () is brought into contact with the target object (), and the pin () is moved away from the discharge opening () to divide the paste in contact with the target object.

Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same

A semiconductor device () includes: a semiconductor chip () having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate () opposed to the first main surface; a first electrode () disposed between the first main surface and the heat dissipating plate () so as to be electrically connected to the semiconductor chip (); a pressure contact member () opposed to the second main surface; a second electrode () disposed between the second main surface and the pressure contact member () so as to be electrically connected to the semiconductor chip (); and a pressure generating mechanism that generates a pressure for pressing the first electrode () into contact with the heat dissipating plate () and the semiconductor chip () and pressing the second electrode () into contact with the pressure contact member () and the semiconductor chip ().

Semiconductor device and method for manufacturing the same

A pressed-contact type semiconductor device includes a power semiconductor element, on an upper surface of which at least a first electrode is formed and on a lower surface of which at least a second electrode is formed, lead frames which face the first electrode and the second electrode of the power semiconductor element respectively, and a clip which applies a pressure to the lead frames while the power semiconductor element is sandwiched by the lead frames, wherein a metallic porous plating part is formed on a surface which faces the first electrode or the second electrode, the surface being a surface of at least one of the lead frames.

Pressed-contact type semiconductor device and method for manufacturing the same

A semiconductor device which can reduce a heat stress to a solder layer while suppressing an increase of thermal resistance is provided. A semiconductor device includes a semiconductor element, a solder layer which is arranged on at least one surface of the semiconductor element and a lead frame which is arranged on the solder layer so that a porous nickel plating part is sandwiched between the lead frame and the solder layer. Compared with a case that the semiconductor element and the lead frame are jointed by a solder directly, an increased part of a thermal resistance of the solder junction is held down only to a part of the porous nickel plating part and a thermal resistance applied to the solder layer can be reduced.

Semiconductor device having a porous nickel plating part

Dummy electrodes () are disposed on wiring connected to first electrodes () of the substrate (), outside a junction region containing all of the first electrodes () and second electrodes () and in bonding resin (), the dummy electrodes () not being involved in electrical connection between the substrate () and the component (). When conductive particles () in the bonding resin () are melted by heating, molten solder self-assembles and solidifies between the first electrodes () and the second electrodes () and on the dummy electrodes (). With this configuration, the solder self-assembles between the adjacent dummy electrodes () and causes a solder short circuit. Thus it is possible to eliminate excessive solder supply between the adjacent first electrodes () and the adjacent second electrodes (), thereby preventing short circuits between the adjacent first electrodes () and the adjacent second electrodes ().

Method of joining electronic component and the electronic component

A wiring board is provided that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. The wiring board has a plurality of layers and includes an ink-jet wiring pattern that is formed in a soluble porous membrane member of any single layer and that includes electrically conductive nanoparticles as a principal material, and a transferred wiring pattern that does not include electrically conductive nanoparticles as a principal material. One layer among the plurality of layers is an electrically insulative substrate. Another layer among the plurality of layers is a porous membrane treated member layer including a porous membrane member at one part of a region of the other layer. The ink-jet wiring pattern is formed in the porous membrane treated member layer. The transferred wiring pattern is formed in the substrate.

Wiring board and wiring board manufacturing method

A circuit board in which end faces () of wires are located in positions withdrawn from the end in a joint region of a first board (), end faces () of wires are located in positions withdrawn from the end in a joint region of a second board (), a gap (W) between the end faces () of the wires of the first board () and the end faces () of the wires of the second board () is filled with a conductor (A), and the first board () and the second board () are jointed by means of a resin.

Circuit board and method for jointing circuit board

An object of the present invention is to provide a method for stably forming an artificial lipid membrane while suppressing the leakage and evaporation of an electrolytic solution. The present invention is an artificial lipid membrane forming method for forming an artificial lipid membrane using an artificial lipid membrane forming apparatus. The artificial lipid membrane forming apparatus comprises a first chamber, a second chamber, a dividing wall, and an artificial lipid membrane forming portion. Each of the first chamber and the second chamber has a capacity of not smaller than 10 pl and not larger than 200 &#x3bc;l. The artificial lipid membrane forming method of the present invention comprises the steps of: preparing the artificial lipid membrane forming apparatus; adding to the first chamber a first electrolytic solution having a viscosity of not lower than 1.3 mPa&#xb7;s and not higher than 200 mPa&#xb7;s; adding a lipid solution to the artificial lipid membrane forming portion; adding to the second chamber a second electrolytic solution having a viscosity of not lower than 1.3 mPa&#xb7;s and not higher than 200 mPa&#xb7;s; and forming the artificial lipid membrane.

Method for forming artificial lipid membrane

An antenna built-in module which incorporates an antenna, is thin and excellent in antenna characteristics, a card type information device and a method for manufacturing the same are provided. A wiring board () which has a wiring pattern () and in which an electronic component is mounted on at least one surface thereof, a magnetic substance () embedded in the other surface of the wiring board (), an antenna pattern () provided on the magnetic substance (), the wiring pattern () of the wiring board () and the antenna terminal electrode of the antenna pattern () are connected by a conductive via ().

Antenna built-in module, card type information device, and methods for manufacturing them

Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring.

Electronic circuit device and method for manufacturing same

A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element.

Storage medium with built-in antenna

Growing community of inventors

Kyoto, Japan

Norihito Tsukahara