Denso Corporation

Other

Norihisa Imaizumi

Yuuki Sanada

Yasutomi Asai

Tohru Nomura

Tetsuto Yamagishi

Masayuki Takenaka

Mitsuhiro Saitou

Yutaka Fukuda

Takeshi Ishikawa

Sadahiro Akama

Toshihiro Nagaya

Koji Numazaki

Shinya Uchibori

Kan Kinouchi

Tomohiro Yokochi

Kengo Oka

Kouji Kondoh

Tatsuya Kakehi

Akira Tanahashi

Toshihiro Nakamura

Akihiro Yamaguchi

Hirotaka Miyano

Tasuke Fukuda

Kenji Matsuda

Masaji Imada

Eiichi Sudo

Seiji Shibata

Keitarou Nakama

Eiji Yabuta

Ryuma Kamikomaki

Gentarou Masuda

A semiconductor package includes a semiconductor chip, a heat radiating member on which the semiconductor chip is mounted, and a sealing member sealing the semiconductor chip. The sealing member is made of a liquid crystal polymer.

Semiconductor package, electronic device, and method for manufacturing semiconductor package

A motor control device controls a motor. The motor control device is provided separate from the motor. The motor control device includes a switch provided in an electrical conduction path for the motor. The motor control device detects a temperature of the switch. The motor control device controls the switch between an on state and an off state.

Motor control device

In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.

Electronic device and method for manufacturing same

In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer.

Electronic device

An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.

Semiconductor device with resin mold

An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.

Semiconductor device

An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.

Electronic device having wiring substrate and lead frame

Soldering paste for bonding an electronic component to electrodes on a ceramic substrate includes alcohol having at least two OH groups, organic acid, and metallic powder. The electronic component disposed on the electrodes through the soldering paste undergoes a reflow performed in a nitrogen atmosphere. Accordingly, an ester film is formed around the electrodes as a reaction product of the organic acid and the alcohol. The ester film incorporates therein the remaining organic acid and metal salt as its reaction product. As a result, high insulation reliability is provided.

Soldering paste, soldering method, and surface-mounted type electronic device

Growing community of inventors

Hoi-gun, Japan

Norihisa Imaizumi