Mitsubishi Materials Corporation

Norihisa Iida

Hiroyuki Mori

Yuki Ito

Motohiro Hitaka

Kazunari Maki

Hirotaka Matsunaga

Isao Arai

Hiroyuki Matsukawa

Shigeru Shimoizumi

Shin Oikawa

Takahiro Takeda

This pure copper plate includes Cu having a purity of 99.96 mass % or higher, with a remainder of unavoidable impurities, wherein an amount of P is 2 mass ppm or less, and a total amount of Pb, Se, and Te is 10 mass ppm or less. The amount of S may be in a range of 2 mass ppm or more and 20 mass ppm or less.

Pure copper plate

A pure copper sheet of the present invention has a composition including 99.96 mass % or more of Cu, 0.01 mass ppm or more and 3.00 mass ppm or less of P, 3.0 mass ppm or more of a total content of Ag and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 μm or more, and, in a case where a measurement area of 1 mmor more is measured by an EBSD method at measurement intervals of 5 μm steps, a measurement point where a CI value analyzed with data analysis software OIM is 0.1 or less is excluded, and a boundary where an orientation angle between adjacent pixels is 5° or more is regarded as a crystal grain boundary, a Kernel average misorientation (KAM) value is 1.50 or less.

A hot-rolled copper plate consists of pure copper having a purity of 99.99 mass % or greater, the hot-rolled copper plate having an average crystal grain diameter of 40 &#x3bc;m or less, and a (&#x3a3;3+&#x3a3;9) grain boundary length ratio (L (&#x3c3;3+&#x3c3;9)/L), which is a ratio between a total crystal grain boundary length L measured by an EBSD method and a sum L (&#x3c3;3+&#x3c3;9) of a &#x3a3;3 grain boundary length L&#x3c3;3 and a &#x3a3;9 grain boundary length L&#x3c3;9, being 28% or greater.

Hot-rolled copper plate

Growing community of inventors

Osaka, Japan

Norihisa Iida