Senju Metal Industry Co., Ltd.

Matushita Electric Industrial Co., Ltd.

Panasonic Corporation

Norihisa Eguchi

Minoru Ueshima

Osamu Munekata

Haruo Suzuki

Hirofumi Nogami

Masayuki Ojima

The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.

Method of replenishing an oxidation suppressing element in a solder bath

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Takatsuki, Japan

Norihisa Eguchi