Murata Manufacturing Co., Ltd.

Norihiro Yoshikawa

Ichiro Nakamura

Yasunori Hioki

Shinichi Kobayashi

Tomomichi Ichikawa

Ichiro Nakaso

Tomoki Inakura

Tomoaki Onoue

Kenji Tanaka

Akihiro Motoki

Makoto Ogawa

Kenichi Kawasaki

Shunsuke Takeuchi

Toshiyuki Iwanaga

Masaru Kojima

Atsuhiro Torii

Hisao Kawamura

A dielectric resin composition for a film capacitor is a mixture containing an organic material A and an organic material B. The organic material A includes at least two kinds of organic material components A, A, . . . having reactive groups (for example, OH, NCO) that cross-link each other. The organic material B does not have a reactive site capable of reacting with the organic material A and has a dielectric loss tan &#x3b4; of 0.3% or less at a temperature of 125&#xb0; C. The mixture has a glass transition temperature of 130&#xb0; C. or higher and preferably 280&#xb0; C. or lower.

Dielectric resin composition for film capacitor and film capacitor

To increase the heat resistance of a film capacitor, a dielectric resin composition is used as a material for a dielectric resin film used in a film capacitor, the dielectric resin composition being cured by mixing and crosslinking two or more organic materials having functional groups that react with each other to provide a cured article. At least one pair highly cohesive atomic groups which has a molecular cohesive energy equal to or higher than that of a methyl group and capable of cohering with each other due to the molecular cohesive energy is linked to the organic material. The highly cohesive atomic groups form a cohesive portion serving as pseudo-crosslinking.

To increase the heat resistance of a film capacitor, a cured article obtained by curing a mixed solution of a polyvinyl acetal having a hydroxyl group content of 10% to 38% by weight, the number of backbone carbon atoms of the polyvinyl acetal being 100 or more, and a polyisocyanate having an isocyanate content of 1% to 50% by weight is used as a dielectric resin films material arranged between first and second counter electrodes facing each other. At least the polyvinyl acetal is subjected to high-pressure homogenization in which a shearing force is applied such that a pressure applied to the polyvinyl acetal is 50 MPa or more when the material is passed through a path having a diameter of 0.125 mm and a length of 5 mm, so that the solubility is increased to allow a curing reaction to proceed uniformly. The cured article has a glass transition temperature of 130&#xb0; C. or higher and a breakdown voltage of 350 V/&#x3bc;m or more.

Provide is a separator for a power storage device, which reliably prevents short circuits between positive and negative electrode layers while maintaining the permeating ions function, and effectively suppresses shrinkage, and a power storage device using the separator. The separator is composed of a composite material including inorganic microparticles and an organic binder, the composite material has a pigment volume concentration of 55% or more, and the inorganic microparticles have an average particle size in the range of 0.2 to 3.0 &#x3bc;m, and a general particle shape index in the range of 0.50 to 0.85. The composite material can have a pigment volume concentration in the range of 55 to 80%, or 55 to 65%.

Separator for power storage device and power storage device

A resin composition constituting dielectric resin films of a film capacitor includes a first atom group including at least one functional group selected from among a methylene group, an aromatic ring and an ether group and having a relatively small molar polarizability, and a second atom group including at least one functional group selected from among a hydroxyl group, an amino group and a carbonyl group and having a relatively large molar polarizability. The resin composition satisfies the condition that a value calculated from the formula (sum of absorption band intensities of first atom group)/(sum of absorption band intensities of second atom group) is 1.0 or more. Herein, as absorption band intensities of the functional groups, peak intensities detected in specific wavenumber ranges are employed.

When external electrodes of a multilayer ceramic capacitor are formed by performing direct plating on surfaces at which internal electrodes are exposed without forming paste electrode layers, bonding forces of plating layers are relatively weak, and in addition, when glass particles are included in the plating layers, blisters are often generated. To overcome these problems, a multilayer ceramic capacitor is formed by performing electrolytic plating using a plating bath including glass particles, electrolytic plating layers including glass particles dispersed therein are formed as the external electrodes.

Ceramic electronic component and method for manufacturing the same

A composite dielectric sheet used to manufacture a multilayer electronic component. The composite dielectric sheet is flexible and has a high dielectric constant and high dielectric strength. The composite dielectric sheet contains a polyvinyl acetal resin; a high-dielectric constant filler, surface-treated with a coupling agent, dispersed in the polyvinyl acetal resin; and a crosslinking agent having two or more functional groups reactable with the polyvinyl acetal resin and the surface-treated high-dielectric constant filler. The composite dielectric sheet is suitable for use in a multilayer electronic component such as a monolithic capacitor.

Composite dielectric sheet, method for producing composite dielectric sheet, and multilayer electronic component

A ceramic green sheet is formed from a ceramic slurry composition comprising a ceramic powder such as BaTiO , a vehicle in the state of emulsion in which an organic binder consisting of polyurethane resin particles having an average particle size of about 120 nm or less is dispersed in an aqueous solvent, and a surfactant comprising an alkyne glycol having one or more triple bonds in its molecule and/or an ethylene oxide addition product of such an alkyne glycol. A very thin aqueous ceramic green sheet is provided that is free from pin holes, and has low surface roughness, high tensile strength and high elongation.

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Nagaokakyo, Japan

Norihiro Yoshikawa