Sony Corporation

Sony Semiconductor Solutions Corporation

Colopl, Inc.

Norihiro Kubo

Hiroaki Ishiwata

Hideo Kido

Tetsuya Uchida

Tetsuji Yamaguchi

Takuji Matsumoto

Hiroyuki Mori

Fumihiko Koga

Keiji Tatani

Kazuichiro Itonaga

Shinichiro Izawa

Susumu Ooki

Yutaka Nishimura

Masahiro Tada

Yoshiaki Masuda

Shinji Miyazawa

Sanghoon Ha

Atsushi Inomata

Chihiro Arai

Atsuhiro Ando

Eita Kikuchi

Sotetsu Saito

An imaging device includes a photoelectric converter, a charge holding section that is provided on a side of the photoelectric converter opposite to a light entrance side of the photoelectric converter and holds a signal charge generated by the photoelectric converter, and a light shielding section that has a first light shielding surface extending toward the charge holding section from between the charge holding section and the photoelectric converter.

Imaging device and manufacturing method thereof

A solid-state imaging device includes a pixel array unit in which a plurality of imaging pixels configured to generate an image, and a plurality of phase difference detection pixels configured to perform phase difference detection are arranged, each of the plurality of phase difference detection pixels including a plurality of photoelectric conversion units, a plurality of floating diffusions configured to convert charges stored in the plurality of photoelectric conversion units into voltage, and a plurality of amplification transistors configured to amplify the converted voltage in the plurality of floating diffusions.

Solid-state imaging device, method of driving the same, and electronic apparatus

The present disclosure relates to an imaging device, a manufacturing method, and an electronic apparatus. An imaging device includes: a sensor substrate with an effective pixel area; a transparent sealing member that seals a surface of the sensor substrate; a sealing resin that bonds the sensor substrate and the sealing member; and a reinforcing resin that bonds the sensor substrate and the sealing member. A product of adhesive strength per unit area of the sealing resin and the reinforcing resin in the outer peripheral region and an area of a part bonded in the outer peripheral region is set to be larger than a product of adhesive strength per unit area of the sealing resin in the effective pixel area and an area of a part bonded in the effective pixel area. The present technology can be applied to, for example, a CMOS image sensor of WCSP.

Imaging device, manufacturing method, and electronic apparatus

A method of providing content using a head-mounted device. The method includes receiving, by a terminal configured to display a screen for logging in to the application, input of user identification information by a user, wherein the user identification information associates the user with a first application. The method further includes receiving, by the terminal, when authentication using the user identification information is successful, a login key for logging in to a content providing service by the first application. The method further includes transmitting, by the terminal, based on input of a login instruction using the login key by the user wearing the head-mounted device, the login key to a server. The method further includes receiving, by the terminal, from the server, content viewable in a head-mounted display mode following successful authentication using the login key.

Method for providing content using a head-mounted device, system for executing the method, and content display device

A method includes defining a virtual space to be associated with a first user. The virtual space includes a second avatar associated with a second user. The virtual space is associated with a first head-mounted device (HMD) connectable to a first computer. The method further includes receiving a signal transmitted from a second computer associated with a second user. The method further includes detecting a communication quality between the first computer and the second computer based on the signal. The method further includes displaying the second avatar in the virtual space based on the detected communication quality.

Method for communicating via virtual space and system for executing the method

Disclosed herein is a solid-state image pickup device of a type wherein a pixel is configured to include a sensor unit capable of photoelectric conversion, the image pickup device including: a semiconductor substrate; a charge storage region of a first conduction type, which is formed in the semiconductor substrate and constitutes a sensor unit; a charge storage sub-region made of an impurity region of the first conduction type, which is formed, in plural layers, in the semiconductor substrate below the charge storage region serving as a main charge storage region and wherein at least one or more of the plural layers are formed entirely across a pixel; and a device isolation region that is formed in the semiconductor substrate, isolates pixels from one another, and is made of an impurity region of a second conduction type.

Solid-state image pickup device and method for manufacturing same, and image pickup apparatus

A solid-state imaging device includes a semiconductor substrate including a pixel portion having a photoelectric conversion portion and a peripheral circuit portion; a first sidewall composed of a sidewall film and disposed on each sidewall of gate electrodes of MOS transistors in the pixel portion; a second sidewall composed of the sidewall film and disposed on each sidewall of gate electrodes of MOS transistors in the peripheral circuit portion; a first silicide blocking film composed of the sidewall film and disposed on the photoelectric conversion portion and a part of the MOS transistors in the pixel portion; and a second silicide blocking film disposed on the MOS transistors in the pixel portion so as to overlap with a part of the first silicide blocking film, wherein the MOS transistors in the pixel portion are covered with the first and second silicide blocking films.

Solid-state imaging device, method of producing the same, and imaging device

Growing community of inventors

Kanagawa, Japan

Norihiro Kubo