Kabushiki Kaisha Nihon Micronics

Norihiro Imai

Tatsuo Inoue

Osamu Arai

Katsushi Mikuni

A method of manufacturing a multilayer wiring board is provided. A flat surface is formed on a surface of a multilayer wiring layer, and resistive material is deposited on the flat surface. The multilayer wiring board comprises a multilayer wiring layer on whose surface convexo-concave is formed, a dummy layer burying the convexo-concave, a resistance material layer made of an electrical resistance material deposited on the dummy layer and at an area going beyond the dummy layer, and a wire made of a conductive material deposited on the resistance material layer and ranging from the area going beyond the dummy layer to a part of the flat surface area of the dummy layer, wherein a resistive element is formed at an area of the resistance material layer that the wire does not reach.

Growing community of inventors

Aomori, Japan

Norihiro Imai