Hitachi Cable, Inc.

Hitachi, Ltd.

Norihiro Ashizuka

Kiyohiko Tanno

Shigetoshi Hiratsuka

Hisao Iizuka

Teruji Satou

Toyoharu Koizumi

Akifumi Higuchi

In a BGA type semiconductor device wherein, while leaving a via hole for a solder ball, an insulating film formed of a photosolder resist (PSR) is provided on a tape substrate on its side where a wiring pattern is provided, a groove portion is provided between a bonding wire sealing portion and the via hole for a solder ball. The groove portion is a smaller-thickness portion of the insulating film provided as a part of the insulating film. By virtue of this construction, at the time of sealing of a wire bonding connection with a mold resin, the flow of the mold resin into the via hole for a solder ball can be prevented.

BGA type semiconductor device, tape carrier for semiconductor device, and semiconductor device using said tape carrier

A fiber optic rotation sensor includes a logic circuit which is supplied with an ambient temperature from a temperature sensor, a light output from an optical fiber sensing loop, and at least two correlation maps from a memory. The correlation maps are prepared at predetermined temperatures by light output values and angular velocities corresponding to the light output values. The logic circuit selects two correlation maps of two temperatures, between which the detected ambient temperature ranges, and provides an angular velocity in accordance with the two temperatures, the detected ambient temperature, and the light output by using the selected two correlation maps.

Fiber optic rotation sensor including a temperature sensor and logic

An optical printer head with a light emitting diode array comprises means for setting a distance between a light emitting surface of a light emitting diode array chip and a rod lens array. The means is provided with two reference position levels at which the light emitting diode array chip and the rod lens array are held. Therefore, there is no necessity for adjusting the distance between the light emitting diode array chip and the rod lens array so that a productivity thereof is much improved.

Optical printer head with a light emitting diode array

Growing community of inventors

Ibaraki, Japan

Norihiro Ashizuka