Sony Corporation

Sony Semiconductor Solutions Corporation

Norihiko Yoshimura

Isao Hirota

Hiroaki Tanaka

Masahiro Inoue

Yuichiro Shiraishi

Shogo Numaguchi

A solid-state image pickup apparatus includes a timing signal generation unit, a plurality of sensor units arranged in a matrix pattern and configured to perform photoelectric conversion of light received on an image pickup surface to accumulate signal charges, a vertical transfer unit provided for each vertical column of the sensor units and configured to transfer the signal charges in a plurality of divided fields in a vertical direction in an image pickup area in a plurality of horizontal blanking periods, a horizontal transfer unit configured to perform a horizontal transfer of the signal charges to the vertical transfer unit along with the horizontal blanking period, and a vertical and horizontal shift control unit configured to control a timing at which the vertical transfer unit transfers the signal charges to the horizontal transfer unit for each vertical column of the sensor units on the basis of the timing signal.

Solid-state image pickup apparatus with vertical transfer unit and horizontal transfer unit; and camera system

A transfer pulse supplying circuit for supplying transfer pulses to a solid-state imaging apparatus including a charge transfer unit includes N (N is an integer of two or more) transfer pulse supplying wirings to which the transfer pulses are supplied, and lead-in wirings connecting the transfer pulse supplying wirings to corresponding lead-out wirings from the charge transfer unit. The respective lead-in wirings have almost the same width and length as one another. At least part of the lead-in wirings is divided into a first region and a second region by slits, and the first region is connected to the transfer pulse supplying wirings and the lead-out wiring, the second region is connected to the lead-out wiring. Regions of the respective lead-in wirings connected to the transfer pulse supplying wirings have almost the same ratio of width to length as one another.

Charge-coupled apparatus and device incorporating a transfer pulse supplying circuit for driving a vertical transfer unit

A solid state imaging device including a plurality of photo diodes disposed in a matrix shape, a vertical transfer unit disposed along each vertical column of the photo diodes, and a horizontal transfer unit in which a predetermined number, two or more, of adjacent vertical transfer units are used as one group to correspond to a unit transfer bit, wherein at least one charge transfer unit corresponding to each group of the vertical transfer unit is provided for each group.

Solid state imaging device with vertical transfer groups

Solid state imaging device

Growing community of inventors

Fukuoka, Japan

Norihiko Yoshimura