Renesas Electronics Corporation

Renesas Technology Corp.

Hitachi, Ltd.

Norihiko Sugita

Takafumi Betsui

Shigezumi Matsui

Motoo Suwa

Naoto Taoka

Yoshiharu Fukushima

Satoshi Imasu

Takahiro Sugimura

Hiroshi Yamada

Toyokazu Hori

Masaru Hase

Tetsuya Yamato

Hideki Tanaka

Naoki Yashiki

Takafumi Kikuchi

Kazuyuki Taguchi

Makoto Suzuki

Seiichi Shirakawa

Tetsuo Ishiguro

A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

Data processing device

The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and with which package structure differs is improved. Semiconductor componentof WPP structure is mounted on the main surface of the interposer substrate which forms a semiconductor device via a plurality of bump electrodes. Semiconductor componentof CSP structure is mounted on the main surface of an interposer substrate via a plurality of bump electrodes with larger diameter and contiguity pitch than the above-mentioned bump electrode. And under-fillingandmutually different, are filled up between the facing surfaces of this interposer substrate and semiconductor components, and between the facing surfaces of the interposer substrate and semiconductor components, respectively.

Method of manufacturing a semiconductor device

Microcomputer having memory interface circuits and memory devices on a module board

A second semiconductor chip including the operation of receiving operation instructions given from a first semiconductor chip and outputting a signal corresponding to it is mounted on mounting means. Internal wirings for interconnecting the first and second semiconductor chips, and external terminals respectively connected to the internal wirings are provided in the mounting means to constitute a multi chip module. Further, a signal path for selectively invalidating operation instructions from the first semiconductor chip to the second semiconductor chip is provided inside the module.

Semiconductor device and its test method

Semiconductor device

A manufacturing method of an electronic device comprises the steps of:

Electronic device and method for manufacturing the same

A bus arbitration apparatus for an image processing processor is operable such that when a channel having a high necessity of a real-time processing operation issues a bus use request, a bus use permission is not given to another channel having a low necessity of a real-time processing operation. The bus arbitrator of the data includes a timer for counting down use permission time with respect to the channel having the high necessity of the real-time processing operation, and a register for the channel having the low necessity of the real-time processing operation. A value larger than a maximum value of the timer is set to the value of the register. In the bus arbitration, the value of the register is compared with that of the timer, and then the bus use permission is given to a channel having the small value.

Data processing processor

The present invention provides a small-sized and inexpensive semiconductor device wherein a synchronous dynamic random access memory and a flash memory are built in a single encapsulater. A flash memory chip and a synchronous dynamic random access memory chip (SDRAM chip) are fixed to a main surface of a wiring board in a parallel state, and another SDRAM chip is fixed onto the flash memory chip. Electrodes for the respective semiconductor chips are respectively exposed and these electrodes are connected to their corresponding electrodes of the wiring board. An encapsulater formed of an insulating resin is formed on the main surface side of the wiring board so as to cover wires. Since the encapsulater is formed by cutting a block encapsulater formed by block molding by dicing, the side faces of the encapsulater result in cut surfaces. Bump electrodes are provided on the back surface of the wiring board in an array fashion.

Semiconductor device and method of manufacturing the same

Growing community of inventors

Tokyo, Japan

Norihiko Sugita