Tokyo Electron Limited

Tokyo Electron Limi Ted

Fujikin Inc.

Norihiko Amikura

Risako Miyoshi

Masatomo Kita

Atsushi Sawachi

Kazuyuki Miura

Toshiaki Toyomaki

Michio Yamaji

Tsutomu Shinohara

Tomohiro Nakata

Jun Hirose

Satoshi Kagatsume

Yukio Naito

Risako Matsuda

Norikazu Sasaki

Masahiko Satoh

Satoshi Muto

Kouji Nishino

Daisuke Hayashi

Yohei Sawada

Hiroshi Koizumi

Masahiro Dogome

Eiji Takahashi

Nobukazu Ikeda

Masaaki Nagase

Hiroshi Tsujimoto

Shin Matsuura

Satoru Yamashita

Takashi Kitazawa

Seiichi Kaise

Nobutaka Sasaki

Kumiko Ono

Toshifumi Ishida

Kazuyuki Tezuka

Gyeong Min Park

Toshiyuki Makabe

Takayuki Hatanaka

Kimihiro Fukasawa

Yasuhiro Shoji

Takami Fukasawa

Keita Shouji

Hideyuki Osada

Genichi Nanasaki

Shinobu Onodera

Yoshiyuki Kato

Yoshiyasu Sato

Yoshiharu Kishida

Kimihiro Yokoyama

Hiroshi Yazaki

Takashi Takizawa

Yoshitaka Kawaguchi

A transfer apparatus includes a transfer arm, an irradiator, a light receiver, and a controller. The transfer arm transfers the member. The irradiator irradiates light obliquely onto a passage area, through which the member passes, when the member is transferred by the transfer arm. The light receiver receives the light, which is irradiated from the irradiator and reflected from the member, when the member passes through the passage area. The controller determines whether the member has passed through the passage area according to whether the light irradiated from the irradiator is received by the light receiver.

Transfer apparatus and transfer method

A substrate processing apparatus is disclosed. The apparatus comprises a vacuum transfer chamber including a top surface, a bottom surface, and side surfaces between the top and the bottom surfaces, including a first side surface and a second side surface opposite to the first side surface; a transfer robot, disposed in the vacuum transfer chamber, for transferring a substrate; a load lock module connected to the first side surface; a pipe, connected to a purge gas supply source, for supplying a purge gas into the vacuum transfer chamber; one or more gas ports provided in the top surface in the vicinity of the second side surface and connected to the pipe; and one or more exhaust ports, provided in the bottom surface in the vicinity of the first side surface, to which an exhaust pump for exhausting the purge gas supplied into the vacuum transfer chamber is connected.

Substrate processing apparatus, purge gas control method, and vacuum transfer chamber cleaning method

A measuring system according to an exemplary embodiment acquires a measurement value indicating electrostatic capacitance between a measuring device and a transport fork for transporting the measuring device. The transport fork includes a target electrode. The measuring device includes a first sensor provided on a base board. The first sensor includes a central electrode and peripheral electrodes. The central electrode acquires electrostatic capacitance for reflecting a distance with the target electrode. The peripheral electrodes are disposed around the central electrode to acquire electrostatic capacitance for reflecting an amount of deviation in a horizontal direction with respect to the target electrode of the transport fork.

Measuring system, measuring device, and measuring method

A transfer device for simultaneously or separately transferring a wafer and a consumable part having a circular shape is disclosed. The consumable part is disposed in a wafer processing module, and the outer diameter of the consumable part is larger than the outer diameter of the wafer. The transfer device comprises an end effector configured to place the wafer and the consumable part thereon simultaneously or separately, an arm configured to move the end effector, and a controller configured to control the arm, to place the consumable part on the end effector such that the center of gravity of the consumable part coincides with a first position when transferring the consumable part, and to place the wafer on the end effector such that the center of gravity of the wafer coincides with a second position between the first position and front ends of the end effector when transferring the wafer.

Transfer device, transfer system, and end effector

A substrate processing system includes a vacuum transfer module; a plasma process module; a transfer robot in the vacuum transfer module; a stage in the plasma process module; a first ring disposed on the stage and a second ring disposed on the first ring to surround a substrate that is placed on the stage, the second ring having an inner diameter smaller than an inner diameter of the first ring; actuators to move support pins vertically to raise the first and the second rings and a transfer jig; and a controller configured to selectively execute a simultaneous transfer mode in which the transfer robot is caused to simultaneously transfer the first ring and the second ring and a sole transfer mode in which the transfer robot is caused to transfer only the second ring.

Substrate processing system and transfer method

According to an aspect of the present disclosure, there is provided a transfer system comprising a transfer robot configured to transfer a transfer target object by an end effector based on an operation instruction, and a controller configured to output the operation instruction to the transfer robot, wherein at least any one of the end effector and the transfer target object has at least any one of a sensor and a camera, the controller calculates a relative position between the end effector and the transfer target object based on at least any one of a detected result of the sensor and a captured result of the camera, and the controller determines a teaching position of the end effector with respect to the transfer target object based on the relative position, and outputs the operation instruction to the transfer robot such that the end effector is disposed at the teaching position.

Transfer system, transfer device, and transfer method

A storage module includes a substrate support, a sensor, a rotating unit, a storage unit and an elevating unit. The substrate support has a consumable member thereon. The sensor detects an orientation of the consumable member. The rotating unit rotates the consumable member in a predetermined direction based on the orientation of the consumable member detected by the sensor. The storage unit is disposed below the substrate support to store the consumable member. The elevating unit vertically moves the storage unit.

Storage module, substrate processing system, and method of transferring consumable member

A performance calculation method is provided. In the performance calculation method, shipment inspection data of multiple flow rate controllers are acquired. Further, first performance values indicating, as deviation values, performance of the flow rate controllers are calculated based on the acquired shipment inspection data and first coefficients for items indicating the performance of the flow rate controllers. Further, second performance values indicating, as deviation values, performance of a processing apparatus using the flow rate controllers are calculated based on the calculated first performance values and second coefficients for items indicating the performance of the processing apparatus.

Performance calculation method and processing apparatus

A processing system capable of increasing an operating time of the processing system is provided. The processing system includes a vacuum transfer module, a plurality of processing modules, a plurality of load-lock modules, and a plurality of atmospheric transfer modules. The vacuum transfer module is configured to transfer a substrate in a pressure lower than an atmospheric pressure. The processing modules are connected to the vacuum transfer module and configured to process the substrate. The load-lock modules are connected to the vacuum transfer module. Each of the atmospheric transfer modules is connected to at least one of the load-lock modules and configured to transfer the substrate in an atmospheric environment.

Processing system

A gate valve opens and closes a first opening of a first chamber in a vacuum processing apparatus. The gate valve includes: a valve element configured to open and close the first opening; a drive configured to move the valve element so that the valve element takes at least a closing position, where the valve element closes the first opening, and an opening position, where the valve element opens the first opening; a first gas line and a second gas line; and a first switching valve that connects one of the first gas line and the second gas line to the drive. The drive moves the valve element from the opening position to the closing position by pressure of gas supplied from the first gas line or the second gas line, and holds the valve element at the closing position by pressure of gas supplied from the second gas line.

Gate valve and driving method

There is provided a processing system. The processing system comprises: a chamber in which a consumable member is installed; a storage module configured to store the consumable member; a position detection sensor configured to detect a position of the consumable member; a vacuum transfer module connected to the chamber and the storage module, the vacuum transfer module having a transfer robot configured to transfer the consumable member between the chamber and the storage module; and a controller. The controller is configured to perform processes of: (a) controlling the transfer robot to transfer the consumable member installed in the chamber to the storage module; (b) detecting the position of the consumable member transferred to the storage module by the position detection sensor; and (c) controlling the transfer robot to transfer a new consumable member different from the consumable member from the storage module to the chamber at a position adjusted based on the position of the consumable member detected in the process (b).

Processing system and transfer method

A substrate processing system includes a substrate processing module, an atmospheric substrate transfer module, a first and a second vacuum substrate transfer module, a load lock module, and a vacuum substrate transfer robot. The first vacuum substrate transfer module having a first transfer space is disposed adjacent to the atmospheric substrate transfer module and the substrate processing module. The second vacuum substrate transfer module, having a second transfer space in communication with the first transfer space and external dimensions smaller than those of the first vacuum substrate transfer module in a plan view, is disposed on or under the first vacuum substrate transfer module. The load lock module is disposed between the atmospheric substrate transfer module and the second vacuum substrate transfer module. The vacuum substrate transfer robot is disposed in the first transfer space or the second transfer space to transfer a substrate.

Substrate processing system, vacuum substrate transfer module, and substrate transfer method

A substrate transfer system includes an atmospheric substrate transfer module, a vacuum substrate transfer module, and a load lock module disposed on a side surface of the atmospheric substrate transfer module and disposed on an upper surface or a lower surface of the vacuum substrate transfer module. The load lock module includes a container having a first substrate transfer opening and a second substrate transfer opening, a first gate configured to open or close the first substrate transfer opening, a second gate configured to open or close the second substrate transfer opening, and a substrate actuator configured to vertically move a substrate through the second substrate transfer opening between a first position in the container and a second position in the vacuum substrate transfer module.

Substrate transfer system and load lock module

A substrate processing method is provided. In the method, a process gas is supplied into a chamber. A pressure in the chamber is controlled to a first pressure by evacuating the chamber via a first exhaust line. Then, the pressure in the chamber is controlled to a second pressure that is higher than the first pressure by evacuating the chamber via a second exhaust line while closing the first exhaust line. Next, the pressure in the chamber is controlled to the first pressure by evacuating the chamber via the first exhaust line while closing the second exhaust line.

Substrate processing method, pressure control apparatus and substrate processing system

A substrate transfer system includes a load lock module, an atmospheric transfer module having a first sidewall adjacent to the load lock module and a second sidewall remote from the load lock module, the atmospheric transfer module being connected to the load lock module, and a substrate transfer robot disposed in the atmospheric transfer module. The substrate transfer robot includes a base configured to reciprocate along the first sidewall, a substrate transfer arm disposed on the base, and a flow rectifier surrounding the base, the flow rectifier being configured, upon movement of the base, to create an obliquely downward air flow in a direction opposite to a moving direction of the base.

Substrate transfer system and atmospheric transfer module

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Miyagi, Japan

Norihiko Amikura