Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Norifumi Eguchi

Teruaki Kasai

Kazuo Arikado

Takashi Uchino

Shinji Sasaguri

Toshiki Abe

Naoki Yamauchi

Masao Hidaka

Hiroshi Ariyoshi

Tadashi Shinozaki

Toru Nakazono

A challenge to be met by the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that enable a reduction in the frequency of operation required with switching of a component type, to thus enhance productivity. In component mount operation for taking chips of component types A, B, and C out of a component supply portion by means of a single mount head and mounting the chips on two substrates held by a first lane and a second lane, when a subsequently-carried-in subsequent substrate has come to be able to undergo component mount operation before completion of processing pertaining to a preceding substrate mount process in which component mount operation is carried out on a previously-carried-in preceding substrate among a plurality of substrates, processing pertaining to a subsequent substrate mount process is started by taking, as mount start components, chips already serving as targets of component mount operation for the preceding substrate at this timing, and processing pertaining to the preceding substrate mount process during which mounting is not yet completed is continually carried out. Thereby, the frequency of operation required with switching of a component type, such as replacement of a nozzle, can be reduced.

Method and apparatus for electronic component mounting

In a mounting apparatus for mounting conductive ball where a conductive ball,is picked up by vacuum to a suction hole,formed in the bottom of a suction head,for mounting on a workpiece, a reference wave form that represents the amount of light detected at a light detector,when a suction head,is sucking a conductive ball,rightly in the normal state is compared with a wave form detected at the light detector,when actually mounting the conductive ball; also a reference wave form detected at the light detector,when there is no conductive ball,at all on the suction head,is compared with a wave form detected at the light detector,after mounting of the conductive ball is finished. Through the above described processing, errors in the light interruption that stem from a tilted suction head,and machining errors during processing of suction holes,are eliminated, and the existence, or non-existence, of the conductive ball,is detected at a high accuracy level.

Method of mounting conductive ball

A die bonder equipped with an image recognition unit having a zoom optical system for placing a chip to a correct location in accordance with recognition results delivered from the image recognition unit. Data related with the recognition offset data that specify a relationship in the relative location between optical coordinates system and mechanical coordinates system, and the pixel rate, etc. are stored in advance in a correction magnification index memory section, maintaining linkage to respective zoom magnification indices. Results of recognition are converted from a location information in terms of an optical coordinates system into a location information in actual dimensions in terms of a mechanical coordinates system of the die bonder, using a datum selected among the data in accordance with a magnification index at which the chip was pictured by a camera of an image recognition section. The data setting operations, which were required to be done at each time when the zoom magnification rate is changed, are made automatically to an increased operational advantage.

Automatic assembly apparatus and automatic assembly method

Growing community of inventors

Saga, Japan

Norifumi Eguchi