Kabushiki Kaisha Nihon Micronics

Norie Yamaguchi

Yoshiei Hasegawa

Satoshi Narita

Takashi Ogasawara

Kenichi Washio

Yukihiro Hirai

Tadashi Sugiyama

Syu Jimbo

Takahiko Tandai

Keita Koyahara

An inspection unit in which a probe card is united with a connection body via a vacuum chamber. It prevents flatness of tips of probes provided on the probe card from worsening when the probe card is united with a connection body by suction force (negative pressure) of the vacuum chamber. The inspection unit includes a probe card with probes on a first surface and a connection body united with a second surface of the probe card via a first vacuum chamber. The first chamber is formed with a plurality of chambers.

Inspection unit, probe card, inspection device, and control system for inspection device

The present invention provides a probe block, which comprises 1) a conductive base on which a first groove is formed, 2) a pair of signal transmitting probes which have dielectric covers and are placed parallel to each other in the first groove, and 3) a ground probe which is in contact with the conductive base, wherein front portions of the signal transmitting probes and the ground probe protrude from the conductive base to form signal transmitting probe needles and a ground probe needle, respectively. The probe block of the present invention has excellent high frequency responses characteristics and is easy for maintenance.

Probe block, probe card and probe apparatus both having the probe block

An inspection apparatus and an inspection method is provided having a wafer chuck stage equipped with one or more wafer chucks; a position measurement unit for measuring the positions of the light emitting devices on each of the expanded wafers loaded respectively on the wafer chucks; a photodetector and at least one probe provided corresponding to each of the expanded wafers; and a control unit provided with means for moving the wafer chuck stage in the X axis and/or Y-axis directions such that the light emitting devices on each of the expanded wafers are sequentially brought under the corresponding probes, means for moving each of the probes to a place corresponding to the electrodes in the light emitting devices, and means for bringing the probes into contact with the corresponding electrodes.

Inspection apparatus and inspection method for light emitting device

A probe card including a plurality of probe blocks can be easily put together substantially in a lattice-like form, and four chips adjoining around the intersection portion of imaginary boundary lines intersecting at right angle each other form a cross-like shape to be tested simultaneously. A plurality of probe blocks with the first and second probe group including a plurality of probes are set up on a base plate substantially in the lattice-like form by a probe set-up means. The needle points of the first and second probe groups are respectively located across the imaginary line so as to oppose to each other. A probe blocks located around the lattice intersection portion are fitted to the base plate such that the needle point parts of the probes located in the vicinity of the lattice intersection portion are positioned on the same side with respect to their needle rear part.

Growing community of inventors

Tokyo, Japan

Norie Yamaguchi