Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Noriaki Yoshida

Kanji Hata

Akira Kabeshita

Takeshi Takeda

Yoshihiro Mimura

Osamu Okuda

Takeyuki Kawase

Takashi Noyama

Naoyuki Kitamura

Shinji Morimoto

Masao Iritani

Masatoshi Yanagawa

Tetsutarou Hachimura

Takashi Shimizu

Yoshihiko Misawa

Hideaki Watanabe

Shigeki Imafuku

Hiroshi Uchiyama

Naoto Mimura

Nobuhisa Watanabe

Yoshihiro Yoshida

Taira Ishii

Satoshi Tanaka

Toshiro Nishiwaki

Mitsuo Kawate

Yasuharu Ueno

Makoto Morikawa

Wataru Hirai

Hiroyuki Yoshida

Shuichi Hirata

Junichi Hada

Shozo Fukuda

Masanori Yasutake

Osamu Nakao

Junkei Shimizu

Makoto Sueki

Youichi Tanaka

Hiroto Miyazaki

Koji Odera

Yoshifumi Nakao

Tomonori Sano

Akira Mouri

Toru Chikuma

Junichi Kawashima

A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to slow down starting position where there is no risk that the electronic component makes contact with the substrate (S), and from there the head is lowered at low speed until a predetermined target contact load is detected. The process of lowering the head at low speed includes the steps of moving down the head a predetermined distance (S), measuring load after the step of moving down the head (S), and determining whether the measured contact load has reached the target contact load (S). The steps of moving down the head (S) and measuring the load (S) are repeated until the measured load reaches the target contact load. The actual load is precisely controlled to be close to a very small set level of target contact load. Accordingly, electronic components using low dielectric constant material are mounted without the risk of damage.

Method of controlling contact load in electronic component mounting apparatus

A component mounting apparatus has a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a horizontal axis, component suction nozzles attached to the rotary member, driving mechanisms for rotating corresponding component suction nozzles, and a recognition section for recognizing components sucked by the component suction nozzle. Each of the first and second mounting head sections performs successive suction, recognition, posture adjustment, and mounting of the components.

Component mounting method

When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.

In component mounting for executing a component feed operation and component holding and pickup operation, a recipe for the component holding and pickup operation that is an operational program for executing the component holding and pickup operation is received in a head unit, and the component holding and pickup operation is executed on the basis of the recipe. In addition, a timing signal based on this execution is transmitted from the head unit to a component feed unit, a recipe for the component feed operation for executing the component feed operation is received in the component feed unit, and the component feed operation is completed on the basis of this recipe and the timing signal transmitted from the head unit.

Component mounting apparatus and component mounting method

In accordance with a component mounting apparatus, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The apparatus functions to, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, hold the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

Component mounting apparatus

A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.

Component mounting apparatus and method

Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a board transfer path. These components are then successively mounted onto a board positioned in the board transfer path. Moved in third and fourth orthogonal directions is a second mounting head section having second nozzles. The second mounting head section is rotated such that the second nozzles rotate and successively pickup components from a second component supply table arranged on an opposite side of the board transfer path. These components are then successively mounted onto the board while positioned in the board transfer path.

There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.

Component mounting apparatus having component supply tables provided on opposite sides of a component transfer path

A component mounting apparatus have a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a horizontal axis, component suction nozzles attached to the rotary member, driving mechanisms for rotating corresponding component suction nozzle, and a recognition section for recognizing components sucked by the component suction nozzle. Each of the first and second mounting head section performs successive suction, recognition, posture adjustment, and mounting of the components.

In accordance with a component mounting method, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The method includes, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, the operation of holding the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

Device and method for mounting parts

A parts mounting method employing a suction section having a plurality of suction nozzles is provided. The suction section is moved to a parts supply section in which a plurality of parts are suctioned by the suction nozzles at the same time. The parts are then mounted onto a board. The suction nozzles are divided into groups: a first group having a shift amount within an allowable range in which simultaneous suction is possible; and a second group having a shift amount outside the allowable range in which simultaneous suction is possible. The parts are then sucked at the same time for each of the groups.

Method for mounting electronic component

Growing community of inventors

Ikeda, Japan

Noriaki Yoshida