Mitsubishi Chemical Corporation

Mitsubishi Engineering-plastics Corporation

Noriaki Terada

Takumi Watanabe

Shogo Koga

Tsuyoshi Nagasaka

Kazuma Inoue

Shoya Yoda

Kazunari Matsumura

Hiroo Miyauchi

Hayato Ogasawara

Naomi Fujimori

Akemi Hosokawa

Yuki Haruta

Satoshi Mochida

Yasuyuki Irie

Shohei Hirase

A polyorganosiloxane may be high in elasticity and/or strength. The polyorganosiloxane may include an M unit (RRRSiO) at a content of 10 mol. % or more relative to the total of silicon and a T unit (RSiO) at a content of 80 mol. % or less relative to the total of silicon. The polyorganosiloxane may have an alkoxy group bound, at a content of 0.07 to 4 wt. %, based on total polyorganosiloxane weight, and a reactive functional group bound to silicon, with 3 to 12 of the reactive functional groups bound on a number basis per a molecular weight of 1000 of the polyorganosiloxane. The weight loss of the polyorganosiloxane at 110° C. under 0.15 torr for 2 hours may be 5 wt. % or less.

Polyorganosiloxane, polyorganosiloxane composition, cured product, polyorganosiloxane-containing electrolytic solution for electrolytic capacitor, and electrolytic capacitor using same

A thermoplastic resin composition, may include a thermoplastic resin (A) and, per 100 parts by mass of the thermoplastic resin (A), from 0 to 0.2 parts by mass of a metal salt-containing flame retardant (B), and not less than 0.05 parts by mass and less than 3 parts by mass of an organopolysiloxane (C), wherein the organopolysiloxane (C) has a molecular weight distribution (Mw/Mn) in a range of from 1.01 to 1.4.

Thermoplastic resin including a flame retardant and organopolysiloxane

Provided are a polyorganosiloxane high in elasticity, high in strength and the like. The polyorganosiloxane is a polyorganosiloxane including an M unit (RRRSiO) at a content of 10% by mol or more relative to the total of silicon and a T unit (RSiO) at a content of 80% by mol or less relative to the total of silicon, the polyorganosiloxane having an alkoxy group bound and a reactive functional group bound to silicon, wherein the polyorganosiloxane has the alkoxy group bound at a content of 0.07 to 4% by weight based on the total weight of the polyorganosiloxane and has 3 to 12 of the reactive functional groups bound on a number basis per a molecular weight of 1000 of the polyorganosiloxane, and the weight loss of the polyorganosiloxane in heating at 110&#xb0; C. under a reduced pressure of 0.15 torr for 2 hours is 5% by weight or less.

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Noriaki Terada