Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Noriaki Koga

Tadaaki Ikeda

Takuro Endo

Shinji Tokutomi

Koki Fujiwara

A resin-sealing mold for sealing a semiconductor element with resin includes an upper die (), a lower die () disposed so as to be opposed to the upper die (), and a plurality of middle dies () sandwiched between the upper die () and the lower die (), wherein the plurality of middle dies () are provided with molding faces at tip ends and are placed so that the molding faces are opposed to each other during the sealing. Because of this, the middle dies () can be opened to the right and left from dividing faces I, and even a resin package of a semiconductor device with a concave part formed in a side surface can be molded.

Resin-sealed mold and resin-sealed device

A light-emitting diodeaccording to the present invention includes: a semiconductor light-emitting devicemounted on the surface of lead framesandand a transparent resin packagecovering the front side of the semiconductor light-emitting device. A convex lens portionfor concentrating light emitted from the semiconductor light-emitting devicetoward the front is provided in a surface part of the resin package. A circular flat portionfor diffusing light emitted from the semiconductor light-emitting devicetoward the sides is provided in a part of the convex lens portionintersecting the optical axis of the convex lens portion. Part of the convex lens portionsurrounding the circular flat portionis a convex-lens side face. A recesswhose side wall is partly the convex-lens side face is provided to surround the convex lens portion.

Growing community of inventors

Kagoshima, Japan

Noriaki Koga