Nitto-denko Corporation

Noriaki Harada

Hiroyuki Katayama

Yuji Hotta

Shunsuke Noumi

Naoki Sadayori

Ichiro Suehiro

Katsumi Ishii

Yoshihide Kawaguchi

Atsushi Hiro

Atsuko Mizuike

Osamu Hayashi

Ichirou Suehiro

Kazuki Uwada

Kouji Akazawa

Ryuuichi Kimura

Kazuki Uawada

It is an object of the present invention to provide a composite semi-permeable membrane exhibiting excellent chemical resistance and having practical water permeability and salt-blocking property, and a method for producing the same. The present invention relates to a composite semi-permeable membrane, including a porous support and a skin layer formed on a surface of the porous support, wherein the porous support contains a thermosetting resin porous sheet having a three-dimensional network structure and pores communicating with each other and wherein the thermosetting resin porous sheet has an average pore diameter of 0.01 to 0.4 &#x3bc;m.

Composite semi-permeable membrane and method for producing same

Disclosed is a method for easily producing a long porous thermosetting resin sheet which has no resin coating film on the surface. Also disclosed are a porous thermosetting resin sheet produced by the method, and a composite semipermeable membrane having excellent chemical resistance and practical water permeability and salt-blocking property. The porous thermosetting resin sheet can be produced by forming a cylindrical or columnar resin block which is composed of a cured product of a thermosetting resin composition containing a thermosetting resin, a curing agent and a porogen; then forming a long thermosetting resin sheet by cutting the surface of the resin block at a certain thickness; and then removing the porogen from the thermosetting resin sheet.

Method for producing porous thermosetting resin sheet, porous thermosetting resin sheet and composite semipermeable membrane using same

The present invention relates to a process for producing an optical semiconductor device, the process including: disposing a sheet for optical-semiconductor-element encapsulation including a resin sheet A and a plurality of resin layers B discontinuously embedded in the resin sheet A and a plurality of optical semiconductor elements mounted on a substrate in such a way that each of the plurality of optical semiconductor elements faces either one of the plurality of resin layers B; and followed by embedding each of the plurality of optical semiconductor elements in either one of the plurality of resin layers B. According to the process of the invention, optical semiconductor elements can be embedded at once. As a result, an optical semiconductor device which is excellent in LED element protection and durability can be easily obtained. Consequently, the optical semiconductor device obtained can have a prolonged life.

Process for producing optical semiconductor device

The present invention provides a light pipe for a direct-type backlight having an upper surface and a lower surface, which has: a light reflecting member provided on the upper surface; and plural light scattering members formed concentrically on at least one surface selected from the upper surface and the lower surface, wherein each of the plural light scattering members is a circular groove or a circular projection, wherein each area between respective light scattering members is substantially the same.

Light pipe for direct-type backlight and direct-type backlight

The present invention provides A direct-type backlight having: a resin sealing member including at least one resin layer, which has a light reflecting section formed on the outermost surface of the resin sealing member; an optical semiconductor element sealed by the resin sealing member; and plural circular light scattering grooves formed concentrically on at least one surface of the resin layer, wherein an area of a circle in the center and an area among the respective concentric circles are substantially the same.

Direct-type backlight

The invention provides a sheet for optical-semiconductor element encapsulation, which has a multilayer structure including at least two resin layers. The at least two resin layers include: (A) an outermost resin layer (layer A) that is to be brought into contact with one or more optical semiconductor elements; and (B) a resin layer (layer B) disposed on the layer A and having a lower refractive index than that of the layer A. Also disclosed is a process for producing an optical semiconductor device using the sheet.

Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet

The invention provides a process for producing a light-emitting semiconductor device, which comprises: (1) forming a polycarbodiimide-containing layer on a light takeout side of a light-emitting semiconductor element; and (2) forming irregularities on the surface of the polycarbodiimide-containing layer.

Process for producing light-emitting semiconductor device

The present invention provides an optical semiconductor device comprising: a wiring circuit board; at least one optical semiconductor element mounted on the wiring circuit board; resin layer A that encapsulates the at least one optical semiconductor element therewith; and resin layer B interposed between the resin layer A and the wiring circuit board, and having a tensile modulus as measured at 30&#xb0; C. of 0.001 to 0.4 GPa.

Growing community of inventors

Osaka, Japan

Noriaki Harada