Kyocera Corporation

Noriaki Hamada

Masahiko Higashi

Kouichi Yamaguchi

Kenichi Nagae

Hideto Yonekura

Youji Furukubo

Yasuhide Tami

Yoshihiro Nakao

Takuji Okamura

Masanari Kokubu

Yasuyoshi Kunimatsu

Takeshi Kubota

Tomohide Hasegawa

Hitoshi Kumatabara

Yasuhiro Sasaki

Koichi Motomura

Yohji Furukubo

Minako Izumi

Michio Shinozaki

A wiring board for a light-emitting element includes a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, the conductor layer having a mounting region mounting a light-emitting element on one surface of the insulating substrate. The insulating substrate includes a heat-conducting pole-like conductor having a thermal conductivity higher than that of the insulating substrate. The heat-conducting pole-like conductor extends through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.

Wiring board for light-emitting element

According to the present invention, there is provided a method of marking a ceramic member, which comprises firing, in an atmosphere, a ceramic green body containing at least 0.05% by weight of a color changing agent capable of developing different color tones by heating in different atmospheres, and heating a specific portion of the resulting sintered body in the other atmosphere to form a marking portion whose color tone is different from that of the other portion, and a marked ceramic member, thereby making it possible to easily form a mark having excellent visibility in a short time without increasing the number of processes.

Method of making ceramic member and marked ceramic member

A glass ceramic sintered product obtained by sintering a mixture powder containing a BaO-containing glass, metal oxide particles having a coefficient of linear thermal expansion at 40 to 400&deg; C. of not smaller than 6 ppm/&deg;C., and a Zr compound and, particularly, containing the Zr compound in an amount of from 0.1 to 30% by weight calculated as Zr0 , and exhibiting a coefficient of linear thermal expansion at 40 to 400&deg; C. of from 8.5 to 18 ppm/&deg;C. The glass ceramic sintered product exhibits excellent resistance against chemicals and does not discolor even when subjected to treatment with an acidic or alkaline solution in the step of plating. A wiring board using the glass ceramic sintered product as an insulating substrate exhibits a coefficient of linear thermal expansion substantially similar to that of an external circuit board, effectively suppressing the occurrence of thermal stress and cracking.

High-thermal-expansion glass ceramic sintered product

A structure for mounting a wiring board in which the wiring board including a ceramics insulating board, metallized wiring layers arranged on said insulating board, and a plurality of connection terminals mounted on said insulating board and electrically connected to said metallized wiring layer, is placed on a mother board having wiring conductors formed on the surface of an insulator which contains an organic resin, and the connection terminals of said wiring board are connected by brazing to the wiring conductors of said mother board, wherein a value F1 defined by the following formula (1):

Structure for mounting a wiring board

A low-temperature calcined ceramic of the present invention comprises a sintered body obtained by calcining a mixture of a glass and an SiO.sub.2 filler such as quartz or cristobalite, wherein the sintered body contains an SiO.sub.2 crystal having an X-ray diffraction image that the peak at the (101) plane of quartz or cristobalite is shifted at least 0.05.degree. (2.theta.) to the lower angle side. The ceramic containing the shifted crystal of quarts or cristobalite does not have a region of abruptly changing the thermal expansion and has a substantially linear thermal expansion curve. Accordingly, when the ceramic is used as an insulating substrate of a wiring boad, there is no possibility of abruptly causing the thermal expansion by heating, etc., at mounting on an external electric circuit boad and the occurrence of the inferior connection, etc., by thermal expansion can be effectively prevented.

Low-temperature calcined ceramics

In a circuit board obtained by providing a metallized layer of wiring on the surface or interior of an insulation substrate, the insulation substrate is, for example, a multi-layer circuit board or a package for semiconductor element, the insutating substrate obtained from a sintered body having a linear expansion coefficient of 8 to 18 ppm/.degree. C. at 40.degree. to 400.degree. C. which is prepared by sintering a molded body containing 20 to 80% of a glass having a liner expansion coefficient of 6 to 18 ppm/.degree. C. at 40.degree. to 400.degree. C. and 80 to 20% of a filler having a linear expansion coefficient of at least 6 ppm/.degree. C. When the circuit board of the present invention is surface mounted on an outer electric circuit substrate such as a printed wiring board having a large linear expansion coefficient, the occurrence of stress due to a difference between the linear expansion coefficients of both is suppressed, and the circuit board and the outer electric circuit can be electrically connected accurately and firmly over a long period of time. Furthermore, a mounted structure of a circuit board having high reliability which can sufficiently dealt with the use of multiple pins due to large sizing of a semiconductor element can be realized. Furthermore, simultaneous sintering with the Cu metallized layer can be performed, and since the binder can be removed efficiently, the product is of high quality and is cheap.

Circuit board

Growing community of inventors

Kokubu, Japan

Noriaki Hamada